| Allicdata Part #: | ATS-12F-15-C3-R0-ND |
| Manufacturer Part#: |
ATS-12F-15-C3-R0 |
| Price: | $ 4.33 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12F-15-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.89781 |
| 30 +: | $ 3.68151 |
| 50 +: | $ 3.46487 |
| 100 +: | $ 3.24834 |
| 250 +: | $ 3.03178 |
| 500 +: | $ 2.81523 |
| 1000 +: | $ 2.76109 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.52°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-12F-15-C3-R0 is a thermal-heat sink that is used to draw heat away from components or devices. This type of heat sink is designed to dissipate thermal energy, allowing for increased system longevity and improved performance.
Heat sinks are essential thermal management solutions, providing cooling to heat sensitive electronics. It works by taking heat away from the component or device and dissipating it into the surrounding environment. Through the use of thermal conduction, heat is transferred from the component or device to the surface of the heat sink.
The ATS-12F-15-C3-R0 is a fairly standard thermal-heat sink designed for general use. It is constructed of aluminum and has a powder-coat finish. It features an integrated fin design, which helps increase the surface area and dissipate heat quickly. This type of heat sink also includes thermal pads for improved heat transfer and insulation. It has a fan that can be used to supplement the heat dissipation function. The fan is built in and runs off of a 12 VDC power supply.
The ATS-12F-15-C3-R0 is most commonly used in applications such as computers, consumer electronics, and industrial systems. It can be used to keep processors and other components from getting too hot or to cool down vital components such as memory or power modules. This type of heat sink is also used in LED lighting systems to keep the lights from overheating.
The working principle of the ATS-12F-15-C3-R0 is based on the fact that heat energy travels from hotter objects to cooler objects. Therefore, when the component or device produces heat, the thermal-heat sink will draw that heat away from it into the environment. Heat is then removed from the device or component with the fan, or through convection with air. The heat sink then dissipates the heat away from the component or device.
The ATS-12F-15-C3-R0 is an ideal choice for those looking for a reliable and efficient thermal management solution. It is highly efficient and provides excellent cooling to components and devices. This type of heat sink is also very cost-effective, making it a great option for anyone looking to improve performance and component longevity without breaking the bank.
The specific data is subject to PDF, and the above content is for reference