| Allicdata Part #: | ATS21130-ND |
| Manufacturer Part#: |
ATS-12F-16-C2-R0 |
| Price: | $ 4.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X10MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12F-16-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.05090 |
| 10 +: | $ 3.94443 |
| 25 +: | $ 3.72506 |
| 50 +: | $ 3.50608 |
| 100 +: | $ 3.28690 |
| 250 +: | $ 3.06777 |
| 500 +: | $ 2.84864 |
| 1000 +: | $ 2.79387 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.08°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management of electronics is important for ensuring the longevity, reliability, and performance of any system. A heat sink is a device designed to transfer and dissipate heat away from an electronic device. There are many different types of heat sinks available for various applications, ranging from low- to high-power applications. One such type of heat sink is the ATS-12F-16-C2-R0.
The ATS-12F-16-C2-R0 is a finned heat sink that is designed for use in applications that require higher power dissipation. This type of heat sink has a number of advantages over other types of heat sinks, such as longer lasting heat sink life and reliable performance. The fins act as additional heat conductors, dispersing heat to larger areas than traditional heat sinks. This helps increase the overall thermal performance of the heat sink.
In addition to its high power dissipation capability, the ATS-12F-16-C2-R0 also offers a wide range of operating temperatures. This allows it to be used in many different types of applications, including those in which temperatures may vary considerably. This heat sink is also designed to be durable, so it can withstand mechanical and environmental stresses without compromising its performance.
The working principle of the heat sink is fairly simple. Heat is transferred from the electronic device to the surfaces of the fins of the heat sink. Heat is then transferred away from the fins by convection, radiation, and natural cooling. The fins also act as additional heat conductors, dispersing heat away from the device to larger areas than a traditional heat sink. This helps increase the overall heat dissipation rate of the heat sink.
As mentioned, the ATS-12F-16-C2-R0 has a wide range of applications. It is commonly used for applications such as air-guided cooling, high-power electronics, and other applications that require thermal management. It is also suitable for sinking heat away from high-powered microcontrollers or graphics cards. The design and performance of the heat sink allow it to dissipate heat from high power devices quickly and efficiently.
Overall, the ATS-12F-16-C2-R0 finned heat sink is an efficient heat sink that can be used in a variety of applications. Its unique fins act as additional heat conductors, allowing heat to dissipate away from the device and to larger areas. This increases the overall efficiency of the device, as well as its lifetime. This makes the ATS-12F-16-C2-R0 an ideal choice for thermal management applications, such as those in which high power dissipation is required.
The specific data is subject to PDF, and the above content is for reference