ATS-12F-17-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.126" (54.01mm)
Width:	2.126" (54.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.500" (12.70mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	15.51°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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ATS-12F-17-C3-R0 Thermal - Heat Sinks: Application Field and Working Principle

THERMAL-HEAT SINKS are one of the most popular types of devices used to dissipate heat. They provide a simple solution to heat management, and are an effective way to keep electronic and electrical components cool. The ATS-12F-17-C3-R0 is a thermal-heat sink that has many applications in various environments, as well as a straightforward and effective operating principle.

Applications

ATS-12F-17-C3-R0 thermal-heat sinks can be used in a variety of devices and applications. The most popular applications include cooling of microelectronic components, such as CPUs, GPUs, and transistors, as well as cooling of DC/AC motors, transformers, and engine exhaust systems. In electrical and telecom equipment, they are often used to cool ICs, power amplifiers, and other high-powered components. The ATS-12F-17-C3-R0 is also ideal for precision equipment, as it can provide highly-accurate heat transfer and cooling in demanding environments.

Working Principle

The ATS-12F-17-C3-R0 thermal-heat sink uses a process known as convective heat transfer. In this process, heat is transferred from a warm surface, such as an electronic component, to a cooler surface, such as the heat sink. This transfer of heat is accomplished by circulating air around the component, allowing it to absorb the heat and dissipate it into the surrounding air. Heat is also removed from the component by the heat sink itself, which is usually made from a metal such as aluminum or copper, and is designed to draw heat away from the component and dissipate it into the air.

Performance

The ATS-12F-17-C3-R0 thermal-heat sink is designed to provide a high level of performance in terms of heat dissipation. Its small size and lightweight design makes it ideal for use in tight spaces or situations where space is at a premium. Additionally, its low-noise operation makes it suitable for use in locations that require quiet operation. The high-efficiency design of the ATS-12F-17-C3-R0 allows it to effectively dissipate heat, while using minimal energy. This makes it an ideal solution for those applications that require high performance and low energy utilization.

Advantages

The ATS-12F-17-C3-R0 thermal-heat sink offers a number of advantages over other cooling solutions. Its small size and lightweight design makes it very easy to install and maintain. Additionally, its performance and efficiency makes it a cost-effective cooling solution. It is also very reliable and durable, making it well suited for use in demanding and hostile environments. Finally, its low-noise operation ensures that it will not disrupt any work or other activities in the vicinity.

Conclusion

The ATS-12F-17-C3-R0 thermal-heat sink is a highly efficient and effective way to dissipate heat from electronic and electrical components. It is small and lightweight, and can be used in tight spaces or environments where space is at a premium. Additionally, its high-efficiency design ensures that it uses minimal energy while providing excellent heat dissipation. It is an ideal cooling solution for a variety of applications, offering a cost-effective, reliable, and durable cooling solution.

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