ATS-12F-192-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-12F-192-C3-R0-ND

Manufacturer Part#:

ATS-12F-192-C3-R0

Price: $ 4.73
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X35MM R-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-12F-192-C3-R0 datasheetATS-12F-192-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.25628
30 +: $ 4.02003
50 +: $ 3.78365
100 +: $ 3.54715
250 +: $ 3.31068
500 +: $ 3.07420
1000 +: $ 3.01508
Stock 1000Can Ship Immediately
$ 4.73
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.378" (35.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 2.43°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks technology is the key in efficient transfer of heat. This technology is used by electronic devices like computers, mobile phones etc. This technology is used to prevent devices from overheating due to prolonged use. One of the key devices for effective heat transfer is the ATS-12F-192-C3-R0. Let’s take a look at the application field and working principle of this device.

Application Field
The ATS-12F-192-C3-R0 is a highly efficient heat transfer device and is often used for servers, routers, hard drives, and other IT equipment where there is concerns for reducing cooling costs or increasing the lifespan of the equipment. The ATS-12F-192-C3-R0 is extremely efficient when working with small products such as notebooks, routers, and other household appliances.

Working Principle
The ATS-12F-192-C3-R0 is made of aluminum and is designed to provide efficient heat transfer from the interior of the operating device. The Heat Sink features multiple fins which work to increase surface area, making sure that as much surface as possible is exposed to the air for cooling. The Heat Sink is also designed to pull the heat away from the operating device and dissipate it into the surrounding air. This prevents the operating device from becoming overly hot, which in turn lengthens the life of the device and improves its performance.

The ATS-12F-192-C3-R0 is a highly advanced and efficient Heat Sink which is capable of providing efficient cooling solutions without needing additional energy consumption. The Heat Sink is designed to keep devices with mounting issues such as space constraints or tight corners safe from overheating. The fins provide plenty of surface area, allowing the Heat Sink to easily dissipate the heat from the device and into the surrounding air. This also makes the Heat Sink more efficient and cost effective as the surrounding air helps to keep the operating device cooler than simply relying on standard fans.

The ATS-12F-192-C3-R0 has been designed to be maintenance and installation free, making it ideal for applications where installation time is short. It is also highly resistant to corrosion and is able to withstand changes in temperature, meaning it can be used in a variety of different conditions without a problem. The solid aluminum material also increases the durability of the Heat Sink, meaning it is highly reliable and can be used in long-term applications.

The ATS-12F-192-C3-R0 can be used in a wide variety of applications where cooling is essential. It is the perfect solution for applications such as servers, routers, and hard drives, and is also highly effective when it comes to cooling small appliances such as notebooks and routers. Its efficient design and durable construction provide an efficient and long-lasting cooling solution which is sure to keep equipment running efficiently and hassle- free.

The specific data is subject to PDF, and the above content is for reference

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