ATS-12F-20-C3-R0

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Heat sinks are essential components that helps dissipate the thermal energy generated by other electronic components in various applications. The ATS-12F-20-C3-R0 is a heat sink from Advanced Thermal Solutions which provides superior performances when used properly. This article will introduce the application field and working principle of the ATS-12F-20-C3-R0.

ATS-12F-20 is a heat sink designed for use with high-power semiconductors and other electronic heat-producing devices. It features a three-finned array that provides superior thermal dissipation with minimal air flow. The C3 version also includes an additional third fin, which provides further heat dissipation compared to other two-fin layouts. The R0 value indicates the size of the heat sink, with ‘R0’ being the biggest size.

Due to its size and efficient design, the ATS-12F-20-C3-R0 is an ideal heat sink for applications where large amounts of heat need to be quickly and effectively dissipated. The heat sink is well suited for use in high-power LED drivers, LED lighting, power-supply units, and other applications that involve the use of high-power semiconductors. The heat sink is also compatible with numerous mounting types, including through-hole, surface-mount, and custom mounting solutions for specific applications.

The ATS-12F-20-C3-R0 is designed to work in two ways: first, it absorbs and stores the thermal energy produced by the electrical components, and then dissipates it into the surrounding air. To assist with this process, the heat sink uses an array of fins. The fins on the heat sink are designed to maximize the amount of surface area exposed to the air, which allows for more efficient thermal exchange. The aluminum alloy construction and high-performance thermal-interface material also help to ensure optimal thermal transfer.

In addition, the ATS-12F-20-C3-R0 features a high-quality construction and design to ensure that it can withstand the rigors of any application. The heat sink is made from aluminum alloy with a black anodized finish to ensure superior corrosion-resistance. It also features a unique clip attachment, which helps ensure secure and reliable installation. With its superior design, the ATS-12F-20-C3-R0 is an ideal choice for applications requiring reliable and efficient thermal management.

The ATS-12F-20-C3-R0 heat sink from Advanced Thermal Solutions offers superior performance when used in applications where large amounts of thermal energy need to be quickly and effectively dissipated. The heat sink is suitable for use with high-power semiconductors and other electronic components, and is designed to maximize thermal exchange to help keep components cool. Its robust construction and secure mounting system make it a reliable and efficient choice for any application.

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