| Allicdata Part #: | ATS-12F-210-C3-R0-ND |
| Manufacturer Part#: |
ATS-12F-210-C3-R0 |
| Price: | $ 6.57 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X12MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12F-210-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.91066 |
| 30 +: | $ 5.58222 |
| 50 +: | $ 5.25395 |
| 100 +: | $ 4.92553 |
| 250 +: | $ 4.59716 |
| 500 +: | $ 4.26879 |
| 1000 +: | $ 4.18670 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.472" (12.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.24°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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A thermal heat sink is a device whose primary purpose is to remove heat from an electronic component or system. The ATS-12F-210-C3-R0 is a thermally managed heat sink specifically designed to meet the needs of ruggedized multi-chip-module (MCM) applications, such as space avionics systems, in which size, weight, and power requirements are particularly stringent. It is used to help cool components within a device, as well as to provide superior thermal management for the device.
The ATS-12F-210-C3-R0 is designed to provide a cooling solution for small-form-factor MCMs, meaning that it does not require a significant volume of air flow in order to operate effectively. It uses an exposed thermal pad that has a maximum recommended operating temperature of 70°C, which is than coupled to a passive heatsink finned structure. This finned structure is designed to increase the surface area for thermal dissipation, and contains a channel that runs through the fin extrusions, allowing for efficient conduction of off-chip heat to the fins.
The ATS-12F-210-C3-R0 also utilizes a copper clip bracket to securely affix the MCM chip to the thermal pad, which allows for a low thermal resistance connection between the two components. This connection ensures that the maximum amount of heat is efficiently conducted from the chip to the fins of the thermal heat sink. Additionally, the fanless design of the ATS-12F-210-C3-R0 helps to reduce the noise levels within the system, and to minimize the space requirements of the system.
The ATS-12F-210-C3-R0 is designed to improve power conversion efficiency by managing device temperatures in a size- and weight-constrained environment. Its fanless design ensures that a low temperature is maintained during system operation, and that low amounts of thermal energy are lost in the power conversion process. This is achieved by having a high surface area for heat transfer, a low thermal resistance connection between the chip and the thermal pad, and efficient conduction capabilities. These characteristics of the design make it an ideal fit for ruggedized MCM applications such as those found in the aerospace and avionics industries. With its superior thermal management capabilities and Size-Weight-Power (SWaP) ratio, the ATS-12F-210-C3-R0 is an excellent choice for thermal management application in these types of environments.
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