| Allicdata Part #: | ATS21189-ND |
| Manufacturer Part#: |
ATS-12F-24-C2-R0 |
| Price: | $ 5.91 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X20MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12F-24-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 5.37390 |
| 10 +: | $ 5.22837 |
| 25 +: | $ 4.93769 |
| 50 +: | $ 4.64726 |
| 100 +: | $ 4.35683 |
| 250 +: | $ 4.06637 |
| 500 +: | $ 3.77592 |
| 1000 +: | $ 3.70330 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.37°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are components used in a wide variety of industrial, commercial, and consumer applications. They are used in applications where thermal performance is critical, including thermal management of computer chips, heat exchangers, and industrial equipment. The ATS-12F-24-C2-R0 is a type of heat sink which is specifically designed to be used in high level applications. It is designed to dissipate heat quickly and efficiently in the most challenging thermally demanding situations.
The ATS-12F-24-C2-R0 is a relatively large heat sink which measures 12” in length and 24” in width, making it suitable for use in larger systems. In addition, the ATS-12F-24-C2-R0 has a thermal dissipation rating of 0.5W/cm2K, meaning that it can dissipate large amounts of heat very quickly. Furthermore, the ATS-12F-24-C2-R0 is capable of dissipating up to 16W of thermal energy.
There are a variety of applications where the ATS- 12F-24-C2-R0 is used. For example, it is often used for thermal management of high-performance computer systems, as well as for industrial machines and electronics. Additionally, the ATS-12F-24-C2-R0 can also be used for cooling electronic components in larger systems such as mission-critical datacenters and high-performance workstations.
The ATS-12F-24-C2-R0 works on the principle of convection. This means that as heat is generated inside a system, the heat is transferred to the ATS-12F-24-C2-R0. Once heat is transferred to the heat sink, it is dissipated into the surrounding air, thus cooling down the system. In addition to offering superior thermal performance, the ATS-12F-24-C2-R0 also offers an aesthetically pleasing design which is suitable for a variety of applications.
In conclusion, the ATS-12F-24-C2-R0 is an effective and efficient thermal management solution for a variety of heat-producing systems. It is made from high-quality materials and is designed to quickly and efficiently dissipate heat away from key components. The ATS-12F-24-C2-R0 is relatively large, measuring 12” in length and 24” in width, making it suitable for use in larger systems. Furthermore, the ATS-12F-24-C2-R0 is capable of dissipating up to 16W of thermal energy and has a thermal dissipation rating of 0.5W/cm2K. Finally, the ATS-12F-24-C2-R0 operates on the principle of convection, making it an ideal solution for cooling electronic components in larger systems.
The specific data is subject to PDF, and the above content is for reference