| Allicdata Part #: | ATS21192-ND |
| Manufacturer Part#: |
ATS-12F-27-C2-R0 |
| Price: | $ 7.71 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X12.7MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12F-27-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 6.94260 |
| 10 +: | $ 6.75486 |
| 25 +: | $ 6.37963 |
| 50 +: | $ 6.00440 |
| 100 +: | $ 5.62918 |
| 250 +: | $ 5.25390 |
| 500 +: | $ 4.87862 |
| 1000 +: | $ 4.78480 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.24°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-12F-27-C2-R0 is a thermal heat sink that is used to help dissipate or transfer heat away from components. It is commonly found in electronics to prevent components from overheating, as temperatures that are too high can cause irreversible damage to the internal parts of the electronic devices. It can also be used in other locations such as industrial settings where the internal temperature of machines needs to be well regulated.
The ATS-12F-27-C2-R0 is a thermal heat sink that utilizes a combination of technologies to dissipate heat away from internal components. It is made from a combination of materials including aluminum and zinc to provide high thermal conductivity and maximum heat dissipation. It utilizes anodized Fin heat sink technology and includes pin fins which are designed to increase convection thermal dissipation.
The main function of the ATS-12F-27-C2-R0 thermal heat sink is to transfer heat energy away from components to another area. The thermal heat sink absorbs the heat energy from the components and then dissipates it through fins that increase the surface area for faster heat transfer. The fins also act as an effective thermal convection, increasing the rate at which heat dissipates away from the internal components.
The ATS-12F-27-C2-R0 is used in a variety of situations in industries such as automotive, medical, industrial, consumer electronics, and military. It is commonly found in electronic applications such as power semiconductors, circuit boards, and batteries. The thermal heat sink helps regulate the heat from these components, helping to ensure that the temperatures do not exceed acceptable levels.
In addition to regulating heat, the ATS-12F-27-C2-R0 thermal heat sink also helps reduce the noise levels from electronic components. It absorbs the vibration energy from the components and converts it into thermal energy, thereby reducing the amount of noise pollution from the device.
The ATS-12F-27-C2-R0 thermal heat sink has a variety of other benefits. It is easy to install, lightweight, and does not require additional power consumption. The thermal conductivity is also extremely high, allowing for quick and efficient heat transfer. The thermal heat sink is also corrosion resistant and offers superior reliability.
Overall, the ATS-12F-27-C2-R0 thermal heat sink is a valuable addition to any electronic device. It helps to regulate the temperature levels of internal components and reduces the amount of noise produced by the device. It also offers superior performance, durability, and reliability.
The specific data is subject to PDF, and the above content is for reference