| Allicdata Part #: | ATS-12F-27-C3-R0-ND |
| Manufacturer Part#: |
ATS-12F-27-C3-R0 |
| Price: | $ 7.24 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X12.7MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12F-27-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 6.51231 |
| 30 +: | $ 6.15027 |
| 50 +: | $ 5.78857 |
| 100 +: | $ 5.42676 |
| 250 +: | $ 5.06498 |
| 500 +: | $ 4.70319 |
| 1000 +: | $ 4.61275 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.28°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are a critical component of electronics in today\'s global market. They are used in a wide variety of applications, ranging from heating and cooling computer chips to providing an alternative means of dissipating electrical heat.
The ATS-12F-27-C3-R0 is a heat sink that is designed for use with temperature controlled applications in electronic circuits. It is made of an aluminum alloy and comes with a metallic finish. It features a series of column-shaped fins that are capable of dissipating heat quickly and efficiently. It has a total surface area of 12 square feet, making it an ideal solution for cooling large electronic components.
The ATS-12F-27-C3-R0 is an ideal solution for a wide range of applications. It can be used as a cooling solution for high-powered computers and other mobile devices. It can also be used in industrial applications such as motors, pumps, and generators. Additionally, it can be used in aerospace and automotive applications.
The way that the ATS-12F-27-C3-R0 functions is simple. It is designed to move heat away from electronic components and into the environment. Specifically, it works by drawing heat from the surface of the device and transferring it away through convection. This approach helps to ensure that the device remains cool and can continue to function optimally.
In addition to the convection process, the heat sink also utilizes a combination of metal-air radiation, infrared radiation, and ventilation. Radiation is the process by which the heat is transferred away from the heat sink to the environment. After the heat is absorbed, the air absorbs the heat from the device and the fins of the heat sink radiate it to the environment. Finally, air is drawn into the heat sink, where it is circulated and cooled, further reducing the heat generated by the device.
The ATS-12F-27-C3-R0 is suitable for a range of applications due to its high-performance properties and affordability. The ability of the metal to transfer heat quickly and efficiently makes it an ideal choice for cooling computer chips, motors, pumps, and other high-powered electrical components. Additionally, its sturdy construction and simple design make it a great value for any budget.
The ATS-12F-27-C3-R0 is an ideal solution for a range of temperature controlled electronic applications. Its efficient performance and affordability make it an ideal choice for cooling a wide range of devices. With its combination of convection, radiation, and ventilation, it is able to effectively move heat away from the device and ensure that it remains cool and functioning optimally.
The specific data is subject to PDF, and the above content is for reference