| Allicdata Part #: | ATS-12F-32-C2-R0-ND |
| Manufacturer Part#: |
ATS-12F-32-C2-R0 |
| Price: | $ 5.81 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X36.83X11.43MM T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12F-32-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.22837 |
| 30 +: | $ 4.93773 |
| 50 +: | $ 4.64726 |
| 100 +: | $ 4.35683 |
| 250 +: | $ 4.06637 |
| 500 +: | $ 3.77592 |
| 1000 +: | $ 3.70330 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 1.450" (36.83mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 21.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important consideration in many applications, from microprocessors to large industrial machines. This is because heat generated by components needs to dissipate into the environment in order to keep the temperature under control. Heat sinks are a common way to provide this cooling, and often require custom designs. The ATS-12F-32-C2-R0 is a heat sink for various applications, and this article will discuss its application field and working principle.
ATS-12F-32-C2-R0 is a medium-sized, black anodized aluminum, self-aligning impeller heat sink with an offset fin array. With its low thermal resistance, it is typically used to cool printed circuit boards (PCBs), power supplies, and other components that generate heat. The heat sink can also be used to provide cooling for high-power LED lighting, and has been designed to handle up to 4V of direct current. Furthermore, the heat sink is water and dust resistant, making it suitable for use in challenging environments.
The fin shape of the ATS-12F-32-C2-R0 is designed to maximize heat transfer to the environment. It has a unique offset fin array that helps to increase surface area and air circulation. Additionally, the heat sink has a black anodized aluminum outer shell, which creates an attractive contrast when used in visible applications. The tight fin pitch of the heat sink ensures that the fins are well separated, allowing for higher air circulation between each fin.
In operation, the ATS-12F-32-C2-R0 works by transferring heat away from the component it is cooling via conduction. As heat is produced by a component, it is absorbed by the enclosed heat sink; the heat is then dissipated into the environment through the fin array. This allows the component to remain cool and maintain its peak performance. Furthermore, since the heat sink is constructed from an anodized aluminum outer shell, the surface is highly durable, meaning that it will withstand any environment.
The ATS-12F-32-C2-R0 is an ideal heat sink for many applications. It has low thermal resistance, a durable black anodized aluminum outer shell, and an adjustable fin array that allows high air circulation. It is reliable and efficient, and will provide superior cooling performance for a variety of components, making it the ideal choice for many thermal management needs.
The specific data is subject to PDF, and the above content is for reference