| Allicdata Part #: | ATS-12F-33-C1-R0-ND |
| Manufacturer Part#: |
ATS-12F-33-C1-R0 |
| Price: | $ 5.41 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X36.83X17.78MM |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12F-33-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.86990 |
| 30 +: | $ 4.59900 |
| 50 +: | $ 4.32860 |
| 100 +: | $ 4.05802 |
| 250 +: | $ 3.78748 |
| 500 +: | $ 3.51695 |
| 1000 +: | $ 3.44932 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 1.450" (36.83mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.700" (17.78mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 17.40°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
The ATS-12F-33-C1-R0 is a thermal heat sink element specifically designed for use in low temperature applications. It is a compact, cost-effective device which is designed to transfer heat away from vital components of a system to keep it running efficiently. It is also highly reliable, low maintenance, and capable of providing thermal protection for a wide range of products.
ATS-12F-33-C1-R0 Application Field
The ATS-12F-33-C1-R0 is designed for use in applications where cooling is necessary to keep the system running at peak performance. It is suitable for controlling temperatures in electrical enclosures, automotive and industrial electronics, and motors. It is also useful for cooling computer systems and other types of equipment. The ATS-12F-33-C1-R0 can also protect sensitive electronic components from overheating and damage.
ATS-12F-33-C1-R0 Working Principle
The ATS-12F-33-C1-R0 works by rapidly dissipating heat away from the component or system in which it is installed. The temperature of the device is maintained through a series of finned dissipaters which allow cooling air to flow over its surface. Heat is rapidly moved away from the device and kept away from sensitive components.
The ATS-12F-33-C1-R0 also offers several other temperature management features. It is designed to operate in low-temperature applications, and it also provides temperature sensing and control capabilities. This minimizes the risk of overheating and other related problems caused by improper temperature management.
Conclusion
The ATS-12F-33-C1-R0 is a reliable, cost-effective, and efficient thermal heat sink device which quickly and effectively dissipates heat away from components and systems. It offers a wide range of features which enable proper temperature management and thereby prevent damage caused by excessive heat.
The specific data is subject to PDF, and the above content is for reference