| Allicdata Part #: | ATS-12F-50-C3-R0-ND |
| Manufacturer Part#: |
ATS-12F-50-C3-R0 |
| Price: | $ 3.54 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-12F-50-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.22182 |
| 30 +: | $ 3.13467 |
| 50 +: | $ 2.96050 |
| 100 +: | $ 2.78630 |
| 250 +: | $ 2.61218 |
| 500 +: | $ 2.52510 |
| 1000 +: | $ 2.26388 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 19.22°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Introduction: Thermal - Heat Sinks, such as ATS-12F-50-C3-R0, are thermal management solutions designed to provide better heat dissipation from electronic components. The heat sink is usually made of aluminium fins or copper baseplate that allow air to freely pass over them. The heat sink will then absorb the heat and disperse it into the surrounding environment. The heat sink provides an improved cooling effect, allowing components to run more efficiently and remain cooler for longer periods of time.
ATS-12F-50-C3-R0: The ATS-12F-50-C3-R0 is a type of Thermal - Heat Sink designed for use in a variety of applications. It is made from a copper baseplate and a number of aluminium fins. The copper baseplate is designed to provide better thermal conductivity than aluminium, allowing more heat to be efficiently dissipated into the environment. The aluminium fins provide a greater surface area for the heat to dissipate and increase air cooling effectiveness. The ATS-12F-50-C3-R0 is great for use in high-power electronics to manage the generated heat.
How Does ATS-12F-50-C3-R0 Work? The ATS-12F-50-C3-R0 has a number of components that work together to reduce the temperature of electronic components. The copper baseplate is designed to provide the best possible thermal conductivity. This allows the heat generated by the electronics to be quickly and efficiently dissipated from the product. The aluminium fins then help to disperse the heat into the environment, allowing the heat to dissipate and have no direct contact with the components.
Application Field of ATS-12F-50-C3-R0 There are a variety of applications for the ATS-12F-50-C3-R0 thermal management solution. It can be used in consumer electronics, automotive, industrial, and military applications. Consumer electronics such as TVs, computers, and game consoles can all benefit from using the ATS-12F-50-C3-R0. Automotive and industrial applications that produce high levels of heat, such as solar power systems, welding machines, and electric motors, can also benefit from using this type of heat sink. The military may also benefit from using the ATS-12F-50-C3-R0 in applications such as aircraft, missiles, and other military systems that can generate large amounts of heat.
Benefits of ATS-12F-50-C3-R0 There are many benefits to using the ATS-12F-50-C3-R0 heat sink. Firstly, the copper baseplate provides excellent thermal conductivity and heat dissipation. This ensures that the heat is quickly and efficiently dissipated away from the components, keeping them cooler for longer periods of time. Secondly, the aluminium fins provide a larger surface area for the heat to dissipate. This helps to ensure that the cooling effect is maximized, allowing components to remain cooler for longer times. Finally, the heat sink is designed for reliability, meaning that it will provide optimal cooling for many years of usage.
Conclusion: ATS-12F-50-C3-R0 Thermal - Heat Sinks are designed to provide superior thermal management in a variety of applications. It provides an excellent thermal conductivity and heat dissipation solution due to its copper baseplate and aluminium fins. It also offers many other benefits such as being highly reliable and providing the maximum possible cooling effect. The ATS-12F-50-C3-R0 is great for use in consumer electronics, automotive, industrial and military applications where thermal management is important.
The specific data is subject to PDF, and the above content is for reference
ATS-12F-50-C3-R0 Datasheet/PDF