| Allicdata Part #: | ATS-12F-60-C1-R0-ND |
| Manufacturer Part#: |
ATS-12F-60-C1-R0 |
| Price: | $ 3.94 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X35MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-12F-60-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.58596 |
| 30 +: | $ 3.38646 |
| 50 +: | $ 3.18730 |
| 100 +: | $ 2.98809 |
| 250 +: | $ 2.78888 |
| 500 +: | $ 2.58968 |
| 1000 +: | $ 2.53987 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.33°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are systems used to cool objects, typically electronics. The ATS-12F-60-C1-R0 is a thermal heat sink specifically designed to cool efficient electronic systems. This guide will cover the application field and working principles of the ATS-12F-60-C1-R0.
The ATS-12F-60-C1-R0 is used to cool devices with high thermal loads in a wide variety of industries. Such components include power electronics, motor control systems, communications systems, motor drives, and other electronic components with high heat output. The ATS-12F-60-C1-R0 is generally installed on customer equipment to dissipate the heat generated by the device.
The ATS-12F-60-C1-R0 consists of three main components: the fan, the heat sink, and the aluminum fins. The fan is responsible for drawing air into the system and increasing airflow across the heat sink, resulting in improved cooling efficiency. The fan is also responsible for providing a cooling effect to the surrounding environment. The heat sink is responsible for transferring the heat generated by the components to the thermal conduction surfaces of the aluminum fins. The fins are responsible for dissipating the heat to the surrounding area. Additionally, the fins act as a barrier, reducing the amount of airflow, thus further improving cooling efficiency.
The ATS-12F-60-C1-R0 is designed to work by utilizing a combination of thermodynamic and mechanical principles. The thermodynamic principles used are based on the laws of thermodynamics and depend on the transfer of thermal energy from the device to the thermal fin material. The mechanical principles used are based on the transfer of air, the interaction of the fan blades, and the heat sink. The combination of these two principles results in the efficient cooling of electronic components.
The ATS-12F-60-C1-R0 is designed to provide maximum cooling efficiency. The combination of air-baffle-designed fins, a high air-flow fan, and a large heat sink ensures that the device operates as efficiently as possible. The aluminum fins are designed to maximize heat transfer, and the fan is designed to ensure the highest air-flow possible. Combined, these elements provide improved cooling efficiency at the lowest possible cost.
In conclusion, the ATS-12F-60-C1-R0 is an efficient thermal heat sink for cooling high thermal-load electronic components. This system utilizes thermodynamic and mechanical principles to ensure the highest cooling efficiency while keeping costs low. It is regularly used in many industries to cool power electronics, motor control systems, communications systems, motor drives, and a wide variety of other devices.
The specific data is subject to PDF, and the above content is for reference
ATS-12F-60-C1-R0 Datasheet/PDF