| Allicdata Part #: | ATS-12F-63-C3-R0-ND |
| Manufacturer Part#: |
ATS-12F-63-C3-R0 |
| Price: | $ 4.16 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12F-63-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.78252 |
| 30 +: | $ 3.57231 |
| 50 +: | $ 3.36206 |
| 100 +: | $ 3.15195 |
| 250 +: | $ 2.94182 |
| 500 +: | $ 2.73169 |
| 1000 +: | $ 2.67917 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.42°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an essential and integral part of any electronic system. As such, selecting the right thermal-management component is paramount in order to ensure that the electronic components run efficiently and reliably, thereby ensuring optimal performance. Thermal-management components like ATS-12F-63-C3-R0 are increasingly in demand due to their effectiveness at safely dissipating heat from high-powered devices.
Thermal-management components are classified into two main categories: heat sinks and fans. Heat sinks rely on thermal conduction to transfer heat away from the electronic component they are attached to while fans impede air in order to disperse the same heat. The ATS-12F-63-C3-R0 is an example of the former - it is a heat sink.
The ATS-12F-63-C3-R0 is a high-performance engineering-grade heat sink specifically designed to effectively cool high-powered devices with its array of fins. It was designed using an advanced extruded-aluminum heat sink technology, which minimizes weight while simultaneously maximizing heat dissipation. This particular heat sink can handle devices with up to 90W power dissipation.
The ATS-12F-63-C3-R0 heat sink is applicable for any kind of device that is high in power consumption, which may include but is not limited to automotive, industrial and aerospace electronics. Some devices may include LED drivers, motor controllers, power amplifiers, RF amplifiers, and switching regulator applications.
In terms of its working principle, heat is conducted through the ATS-12F-63-C3-R0 via a series of aluminum fins or heat fins. The copper baseplate is an additional thermal conductor, and it is where heat is first drawn away from the electronic device. This heat is then dissipated by continuous conduction through the already mentioned fins, and eventually vents off when it is exposed to the surrounding environment.
The ATS-12F-63-C3-R0 is also equipped with an adhesive backing, making it easy to install on any kind of device. The adhesive provides durability and stability and also prevents any vibrations that may be caused by internal moving parts from affecting the heat sink’s efficiency.
To conclude, the ATS-12F-63-C3-R0 is an extremely effective heat sink that is designed to provide optimal cooling for various kinds of electronic devices. It relies on thermal conduction and finning technology to efficiently draw away heat from electronic components. The ATS-12F-63-C3-R0 also has an adhesive backing which provides durability and ease of installation. It is suitable for various applications, particularly those with high power consumption.
The specific data is subject to PDF, and the above content is for reference