| Allicdata Part #: | ATS-12F-75-C3-R0-ND |
| Manufacturer Part#: |
ATS-12F-75-C3-R0 |
| Price: | $ 3.44 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X20MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12F-75-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.12669 |
| 30 +: | $ 3.04206 |
| 50 +: | $ 2.87305 |
| 100 +: | $ 2.70409 |
| 250 +: | $ 2.53507 |
| 500 +: | $ 2.45056 |
| 1000 +: | $ 2.19705 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.29°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important part of many mechanical and electrical applications. Heat sinks are essential components used to dissipate and transfer heat away from electrical components. The ATS-12F-75-C3-R0 is an efficient heat sink specifically designed for a variety of applications. This article will discuss the application field and working principle of the ATS-12F-75-C3-R0.
The ATS-12F-75-C3-R0 is a medium-sized heat sink designed to be used in a variety of applications. It is constructed from a die-cast aluminum alloy with a nominal wall thickness of 0.062”. This alloy provides excellent electrical and thermal properties such as low thermal resistance and high dielectric strength. Its compact design allows it to be used in tight spaces where a large heat sink would be impractical. This heat sink is designed to work with a variety of different fans such as the Sanyo Denki San Ace 70 series.
The ATS-12F-75-C3-R0 is designed to dissipate heat more efficiently than other air cooled heat sinks. It is equipped with fins oriented perpendicular to the source device in order to maximize the surface area that is exposed to the air. This design provides more effective heat dissipation and increased thermal transfer than other air cooled heat sinks. The fins are further optimized to reduce air resistance for improved airflow over the mounting surface. This improved airflow helps reduce the amount of heat buildup in the component, thus providing a longer usable life.
The ATS-12F-75-C3-R0 is highly reliable and has a high thermal shock resistance. This is due to its assembly process which uses controlled soldering and brazing processes in order to reduce vibration and noise. Furthermore, the components are all resistant to corrosion, making them suitable for operation in environments with harsh weather conditions. The integrated design reduces the number of components needed and makes it easier to replace parts if they fail.
The ATS-12F-75-C3-R0 is a highly reliable and efficient heat sink. Its optimized design encourages more efficient heat dissipation and can handle thermal shock and weather extremes. It is suitable for a variety of applications such as digital electronics, home appliances, power supplies, computers, and small motors. It is an ideal choice for users looking for a quiet, reliable, and efficient heat sink.
The specific data is subject to PDF, and the above content is for reference