| Allicdata Part #: | ATS-12F-80-C1-R0-ND |
| Manufacturer Part#: |
ATS-12F-80-C1-R0 |
| Price: | $ 3.25 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12F-80-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.94840 |
| 30 +: | $ 2.86860 |
| 50 +: | $ 2.70925 |
| 100 +: | $ 2.54986 |
| 250 +: | $ 2.39047 |
| 500 +: | $ 2.31079 |
| 1000 +: | $ 2.07174 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.99°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is one of the most important factors in the design of electronic devices. Heat sinks are one of the popular solutions for dissipating excess heat from components. ATS-12F-80-C1-R0 is a thermal-heat sink with high performance and top-notch durability. In this article, we will discuss the application field and working principle of this heat sink.
Applications of ATS-12F-80-C1-R0
ATS-12F-80-C1-R0 is designed for efficient and reliable heat dissipation. It can be used effectively in a wide range of electronic devices with high thermal loads such as computers, consumer electronics, and automotive electronics. This heat sink is also suitable for LEDs, power components, such as CPUs and GPU, as well as memory modules. Additionally, it is also suitable for use in industrial equipment and tough applications.
Working Principle of ATS-12F-80-C1-R0
The ATS-12F-80-C1-R0 heat sink is designed to operate using the principle of convection. This means that it uses an integrated fan and a precise air passage technology to draw in air from the environment and exhaust the heated air to the outside. The integrated fan maintains the airflow at an optimal level, ensuring efficient heat dissipation. The air passage technology allows the air to flow freely and evenly in all directions, thus resulting in a more efficient thermal management.
The thermal conduction of the heat sink is enhanced using its proprietary liquid-heated design. This design uses a highly conductive liquid that works in conjunction with a heat pipe to quickly transfer the heat away from the device and dissipate it to the surroundings. The liquid-heated design is also more efficient than traditional heat sinks and can reduce the temperature of the component by up to 25%.
Conclusion
The ATS-12F-80-C1-R0 is a highly effective thermal-heat sink designed for use in a wide variety of electronic devices. This heat sink operates using the principles of convection and liquid-heated designs for optimal heat dissipation. Additionally, its integrated fan and air passage technology ensure that the airflow is optimized and the heat is quickly dissipated. With this heat sink, you can be sure that your device will be protected from thermal damage.
The specific data is subject to PDF, and the above content is for reference