| Allicdata Part #: | ATS-12F-83-C1-R0-ND |
| Manufacturer Part#: |
ATS-12F-83-C1-R0 |
| Price: | $ 3.79 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X30MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12F-83-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.44736 |
| 30 +: | $ 3.35433 |
| 50 +: | $ 3.16802 |
| 100 +: | $ 2.98166 |
| 250 +: | $ 2.79531 |
| 500 +: | $ 2.70213 |
| 1000 +: | $ 2.42260 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.52°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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.Thermal management is the key to success when it comes to electronic devices. With the demands of a modern digital world, it is important that the components inside a device are able to stay cool despite the power being consumed. Heat sinks are an essential part of a device’s thermal management system, and the ATS-12F-83-C1-R0 heat sink is a perfect example of a high-performance solution.
The ATS-12F-83-C1-R0 is a finned aluminum heat sink, designed to provide effective thermal cooling for electronic components that generate high levels of heat. It features 40 aluminum fins extendingfrom a base, which allows the heat to dissipate more quickly than heat sinks with fewer fins. The fins act as a large surface area for the heat to dissipate into the surrounding environment.
The ATS-12F-83-C1-R0 offers excellent thermal performance thanks to a unique design consisting of an extruded fin profile overlaid with soldered lamellae. These specifically positioned soldered lamellae increase the thermal performance and act as a barrier that prevents transfer of heat from the component to the heat sink. The use of copper in the construction gives the heat sink high durability and strength.
The ATS-12F-83-C1-R0 is designed for use in a wide range of applications, from data centers and telecommunications equipment to automotive components, gaming consoles, and consumer electronics such as televisions and laptops. It is easy to install, and can be placed in almost any orientation. This helps ensure that your device is able to be cooled effectively no matter what.
The working principle of the ATS-12F-83-C1-R0 is simple yet effective. Heat generated by an electronic component is dissipated away from the component by the heat sink’s large surface area. This is done by conduction, as the heat energy is transferred from the component to the heat sink’s fins. As the fins are heated, they warm the surrounding air which carries the heat away in convection.
The ATS-12F-83-C1-R0 is a robust and reliable thermal management solution for any application where thermal efficiency is a top priority. Thanks to its efficient fin design and soldered lamellae, it offers superior thermal performance compared to other heat sinks on the market, ensuring that your device will stay cool and run smoothly.
The specific data is subject to PDF, and the above content is for reference