ATS-12F-90-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-12F-90-C3-R0-ND

Manufacturer Part#:

ATS-12F-90-C3-R0

Price: $ 4.40
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 35X35X35MM R-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-12F-90-C3-R0 datasheetATS-12F-90-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.95577
30 +: $ 3.73611
50 +: $ 3.51628
100 +: $ 3.29654
250 +: $ 3.07677
500 +: $ 2.85700
1000 +: $ 2.80206
Stock 1000Can Ship Immediately
$ 4.4
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.378" (35.00mm)
Width: 1.378" (35.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.378" (35.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is one of the most important aspects of electronic systems design. Heat sinks are utilized in many applications to remove heat from electronic components in order to maintain safe operating temperatures. The ATS-12F-90-C3-R0 is an aluminum heat sink which offers superior thermal conductivity in a compact and lightweight form, making it ideal for many applications.

The high thermal conductivity of the aluminum material used in the ATS-12F-90-C3-R0 heat sink is one of its major advantages. Aluminum is a great conductor of heat, and its lightweight nature makes it an ideal material for use in thermal management applications. This heat sink is able to efficiently dissipate heat away from the components it is paired with, even in tight spaces. It is available in multiple configurations with a range of sizes, shapes, and mounting options to suit the specific needs of each application.

In addition to being an effective thermal conductor, the ATS-12F-90-C3-R0 heat sink also offers superior mechanical strength and durability. The aluminum construction provides stability while remaining lightweight, and the fin design helps to optimize airflow and increase heat dissipation. The fin design also allows the heat sink to be used in a variety of assemblies, as well as orientation-sensitive systems.

The working principle of the ATS-12F-90-C3-R0 heat sink is based on the transfer of heat from the component to the heat sink. When the component is in operation, it generates heat which is transferred to the heat sink. The fins of the heat sink then act as a surface area for the heat to dissipate into the surrounding environment. As the heat transfers to the environment, the temperatures of the component and the heat sink decrease, enabling the component to remain at safe operating temperatures.

The ATS-12F-90-C3-R0 heat sink is suitable for a wide array of applications, such as consumer electronics, automotive systems, industrial control equipment, and more. Its superior thermal conductivity and mechanical strength make it a great option for a variety of systems in need of effective thermal management solutions. Its lightweight construction also allows it to be incorporated into space-limited assemblies without sacrificing performance.

Overall, the ATS-12F-90-C3-R0 heat sink is an ideal choice for many thermal management applications. Its lightweight aluminum construction offers superior thermal conductivity for efficient heat dissipation, as well as superior mechanical strength and durability. The fin design allows the heat sink to be used in both orientation-sensitive and traditional assemblies, while its range of mounting options make it suitable for a wide variety of applications. By utilizing the ATS-12F-90-C3-R0 heat sink, engineers can enjoy superior performance in their thermal management applications.

The specific data is subject to PDF, and the above content is for reference

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