
Allicdata Part #: | ATS-12F-90-C3-R0-ND |
Manufacturer Part#: |
ATS-12F-90-C3-R0 |
Price: | $ 4.40 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 35X35X35MM R-TAB T412 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 3.95577 |
30 +: | $ 3.73611 |
50 +: | $ 3.51628 |
100 +: | $ 3.29654 |
250 +: | $ 3.07677 |
500 +: | $ 2.85700 |
1000 +: | $ 2.80206 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.378" (35.00mm) |
Width: | 1.378" (35.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 1.378" (35.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 6.50°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is one of the most important aspects of electronic systems design. Heat sinks are utilized in many applications to remove heat from electronic components in order to maintain safe operating temperatures. The ATS-12F-90-C3-R0 is an aluminum heat sink which offers superior thermal conductivity in a compact and lightweight form, making it ideal for many applications.
The high thermal conductivity of the aluminum material used in the ATS-12F-90-C3-R0 heat sink is one of its major advantages. Aluminum is a great conductor of heat, and its lightweight nature makes it an ideal material for use in thermal management applications. This heat sink is able to efficiently dissipate heat away from the components it is paired with, even in tight spaces. It is available in multiple configurations with a range of sizes, shapes, and mounting options to suit the specific needs of each application.
In addition to being an effective thermal conductor, the ATS-12F-90-C3-R0 heat sink also offers superior mechanical strength and durability. The aluminum construction provides stability while remaining lightweight, and the fin design helps to optimize airflow and increase heat dissipation. The fin design also allows the heat sink to be used in a variety of assemblies, as well as orientation-sensitive systems.
The working principle of the ATS-12F-90-C3-R0 heat sink is based on the transfer of heat from the component to the heat sink. When the component is in operation, it generates heat which is transferred to the heat sink. The fins of the heat sink then act as a surface area for the heat to dissipate into the surrounding environment. As the heat transfers to the environment, the temperatures of the component and the heat sink decrease, enabling the component to remain at safe operating temperatures.
The ATS-12F-90-C3-R0 heat sink is suitable for a wide array of applications, such as consumer electronics, automotive systems, industrial control equipment, and more. Its superior thermal conductivity and mechanical strength make it a great option for a variety of systems in need of effective thermal management solutions. Its lightweight construction also allows it to be incorporated into space-limited assemblies without sacrificing performance.
Overall, the ATS-12F-90-C3-R0 heat sink is an ideal choice for many thermal management applications. Its lightweight aluminum construction offers superior thermal conductivity for efficient heat dissipation, as well as superior mechanical strength and durability. The fin design allows the heat sink to be used in both orientation-sensitive and traditional assemblies, while its range of mounting options make it suitable for a wide variety of applications. By utilizing the ATS-12F-90-C3-R0 heat sink, engineers can enjoy superior performance in their thermal management applications.
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