| Allicdata Part #: | ATS-12G-11-C1-R0-ND |
| Manufacturer Part#: |
ATS-12G-11-C1-R0 |
| Price: | $ 3.37 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12G-11-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.06684 |
| 30 +: | $ 2.98431 |
| 50 +: | $ 2.81849 |
| 100 +: | $ 2.65268 |
| 250 +: | $ 2.48686 |
| 500 +: | $ 2.40397 |
| 1000 +: | $ 2.15528 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.77°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-Heat Sinks, such as the ATS-12G-11-C1-R0, are devices responsible for efficiently conducting heat from an electronic component into the surrounding environment, allowing the component to maintain optimal temperatures and thereby, its performance. This article will discuss its application field and its working principle in more detail.
The ATS-12G-11-C1-R0 is designed to suit a wide variety of applications in the electronics industry. For example, it’s primarily used in power electronics, transistors, diodes, modules, and IC chips. It’s also often used to cool sensitive components in medical facilities and scientific laboratories.
In terms of its design, this device is composed of two layers: the base material, which is typically copper or aluminum, and the cooling fins which are attached to the base material. Its small size (13x13x23 mm) makes it suitable for a range of applications in which space is limited.
The working principle of this device is based on thermal conductivity. It simply works by transferring heat produced by a component to the surrounding environment via the two-layer construction. The material used in the base helps to absorb the heat and conduct it to the fins. As the fins are relatively large in size, the heat continues to radiate into the environment.
The two layers also provide a highly efficient surface area for the heat to transfer. The more fins present, the larger their surface area, thus allowing for a more efficient transfer of heat. As a result, the device can be efficiently cooled and heat dissipated.
Moreover, this device also has been designed with the right type of heat dissipation material. The base material should preferably have a high thermal conductivity, a high melting point, and low thermal resistance. These materials help to prevent thermal bottlenecks, improve heat transfer, and lower temperatures.
Another feature of this device is its design flexibility. Its construction can be easily adapted to a variety of environmental conditions and can be applied to many different types of electronic components. It can even be modified to accommodate specific thermal requirements.
In conclusion, the ATS-12G-11-C1-R0 is a versatile thermal-heat sink that can be used in a range of applications. It works on the principle of thermal conductivity, and its two-layer construction helps to effectively and efficiently transfer heat from a component to the surrounding environment. Its design also allows it to be easily adapted to specific thermal conditions.
The specific data is subject to PDF, and the above content is for reference