ATS-12G-141-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-12G-141-C1-R0-ND

Manufacturer Part#:

ATS-12G-141-C1-R0

Price: $ 3.27
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 30X30X10MM L-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-12G-141-C1-R0 datasheetATS-12G-141-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.97234
30 +: $ 2.89170
50 +: $ 2.73105
100 +: $ 2.57040
250 +: $ 2.40975
500 +: $ 2.32942
1000 +: $ 2.08845
Stock 1000Can Ship Immediately
$ 3.27
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.181" (30.00mm)
Width: 1.181" (30.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 15.66°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-12G-141-C1-R0 Heat Sink is an essential component for maintaining optimal thermal management in any computer system. With its advanced design, the device efficiently transfers heat away from critical system components to keep them at an optimal temperature for high-performance operation.

The ATS-12G-141-C1-R0 features a number of advantages over other thermal solutions available on the market. It is constructed using a combination of aluminum and copper for maximum heat dissipation. The heat sink can handle up to 12 Watts and has a low profile design for applications with limited space. It also features an optimized fin design for improved airflow and increased heat conduction.

In order to ensure maximum performance, the ATS-12G-141-C1-R0 features a patented Thermal Plate technology. This technology uses a combination of heat pipes and thermal plates that are integrated into the design of the heat sink. The thermal plates enable the device to dissipate heat more quickly and efficiently than traditional heat sinks. Additionally, the Thermal Plate technology helps to improve the cooling performance of the device by reducing the number of fans required in the system.

In addition to the design features, the ATS-12G-141-C1-R0 has a number of additional features that make it a great choice for applications such as graphics cards and CPUs. It is designed to fit into any case and includes mounting hardware for easy installation. It also features a low profile design that helps reduce clutter in smaller systems. The device also offers superior cooling performance with its optimized fan placement and deep fins.

The ATS-12G-141-C1-R0 is compatible with a variety of components and is designed to work with Intel and AMD Socket designs. It also supports single, dual or triple fan configurations. The device also has a low-noise operation which is perfect for applications requiring quiet computing. Additionally, it is designed to be compatible with a wide range of thermal solutions, such as thermal grease, water blocks and vapor chambers.

In terms of applications, the ATS-12G-141-C1-R0 Heat Sink is an ideal choice for gaming PCs, workstations, servers and other intensive applications. It is designed to provide optimal cooling performance, low-noise operation and a compact size. Additionally, its optimized fin design ensures maximum airflow and improved heat conduction. The low profile design of the device helps to reduce clutter in smaller systems for an improved look and feel. Additionally, the device is compatible with a wide range of thermal solutions to ensure an optimal cooling performance in any system.

The specific data is subject to PDF, and the above content is for reference

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