ATS-12G-143-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-12G-143-C1-R0-ND

Manufacturer Part#:

ATS-12G-143-C1-R0

Price: $ 3.42
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 30X30X20MM L-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-12G-143-C1-R0 datasheetATS-12G-143-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.11472
30 +: $ 3.03051
50 +: $ 2.86209
100 +: $ 2.69375
250 +: $ 2.52542
500 +: $ 2.44124
1000 +: $ 2.18870
Stock 1000Can Ship Immediately
$ 3.42
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.181" (30.00mm)
Width: 1.181" (30.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.28°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-12G-143-C1-R0 thermal-heat sink is an effective cooling solution for electronic components. It uses a combination of air cooling and metal conduction cooling to dissipate heat generated by components in a variety of applications. ATS-12G-143-C1-R0 is designed for system integration and has proved to be reliable in terms of power handling and thermal management.

The ATS-12G-143-C1-R0 is a cost-effective and efficient heat-sink system that is used in a variety of applications, ranging from high-performance computing to telecommunications. The thermal-heat sink is constructed from CPC-coated liquid crystal polymer (LCP) materials, creating a thermally-conductive substance that is highly effective at heat dissipation. This, combined with a robust construction, ensures reliable thermal management of any component placed inside the thermal-heat sink.

The ATS-12G-143-C1-R0 employs natural air cooling to help dissipate heat. The air flow is directed from the center of the thermal-heat sink and is guided by strategically placed fins. This allows a higher volume of air to contact the components, increasing the cooling efficiency and heat sink performance. This ensures that the components remain cool, even under periods of intense activity.

In addition to using air cooling, the ATS-12G-143-C1-R0 also features metal conduction cooling. The metal fins found on the thermal-heat sink conduct heat away from the components, and keeps them at a more manageable temperature. This ensures that the components remain cooler in times of intense activity and helps prolong the life of the components. By utilizing the metal conduction cooling, the ATS-12G-143-C1-R0 is capable of dissipating heat effectively and reliably.

Additionally, the ATS-12G-143-C1-R0 is designed to be able to handle high power, as it is capable of dissipating up to 200 W of power. This ensures that the components stay at safe temperatures, even under intense periods of activity. The thermal-heat sink also features a higher temperature range than many other heat sink solutions, ensuring greater flexibility in terms of applications.

The ATS-12G-143-C1-R0 is an effective and reliable thermal-heat sink, designed to offer superior thermal management for numerous applications. Its combination of air cooling and metal conduction cooling offers effective heat dissipation and ensures that the components stay cool, even under periods of intense activity. The heat sink also features an impressive temperature range and is capable of handling high power, making it a versatile and cost-effective option for many applications.

The specific data is subject to PDF, and the above content is for reference

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