ATS-12G-164-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.378" (35.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	2.39°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal - Heat Sinks are components used to dissipate heat away from a device or system. The ATS-12G-164-C1-R0 is a two-stage, high-performance heat sink that is designed to efficiently dissipate heat from electrical and electronic components that generate high temperatures. This thermal-gapped model features faster heat removal from the system, and it is more compact than traditional single-stage heat sinks.

Application Field of ATS-12G-164-C1-R0

The ATS-12G-164-C1-R0 is designed for use with high-powered electronics for reliable cooling in dense, restricted spaces. This two-stage heat sink is an ideal choice for applications where the component temperatures must be maintained at operating temperature, constantly monitored for optimum performance and stability. Common applications for the ATS-12G-164-C1-R0 include servers, computers, and high-power consumer electronics such as television sets, Blu-ray players, and game consoles. It is also an effective choice for aerospace, defense, and industrial applications that require reliable heat dissipation in a small space.

Working Principle of ATS-12G-164-C1-R0

The ATS-12G-164-C1-R0 utilizes two-stage cooling, which is achieved by combining two different heat sinks on the same plate. The two-stage design allows for more effective heat dissipation, due to the enhanced thermal mass.The junction between the two heat sinks is thermal-gapped, providing an even greater thermal mass to the component. This helps the sink absorb more heat, and further helps dissipate the heat away from the component. The air gap between the two heat sinks helps ensure that the efficient and even distribution of the thermal mass is maintained. This allows for longer essential life and higher quality performance from the system.The ATS-12G-164-C1-R0 also features a unique shape and design. This heat sink is made up of a series of aluminum fins, which are arranged in an alternating pattern. This pattern helps to create efficient air movement, ensuring that the heat is quickly and evenly dissipated away from the component.

Conclusion

The ATS-12G-164-C1-R0 two-stage heat sink is designed for use in high-powered electronic applications where cooling thermal mass is a top priority. The thermal-gapped two-stage design increases the heat dissipation capability, and the unique design of the fins helps to ensure that this thermal mass is efficiently distributed and dissipated away from the component. This helps to protect the component from overheating, allowing it to reach its maximum performance and stability.

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