| Allicdata Part #: | ATS-12G-170-C1-R0-ND |
| Manufacturer Part#: |
ATS-12G-170-C1-R0 |
| Price: | $ 3.35 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12G-170-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.04353 |
| 30 +: | $ 2.96100 |
| 50 +: | $ 2.79657 |
| 100 +: | $ 2.63208 |
| 250 +: | $ 2.46758 |
| 500 +: | $ 2.38533 |
| 1000 +: | $ 2.13857 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.02°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are a type of thermal management product designed to dissipate heat from electrical and electronic components. ATS-12G-170-C1-R0 is a specific heat sink model from the Thermal product line of ATS Technology Solutions. It is designed to handle the higher heat loads associated with modern electronics. This document will discuss the application field and working principles of the ATS-12G-170-C1-R0.
Applications
The ATS-12G-170-C1-R0 is a high performance heat sink ideal for a variety of applications, such as power supplies, LED arrays, IC packages, medical equipment, servers, and automotive electronics. It is also commonly used in commercial and military electronics. The ATS-12G-170-C1-R0 features an ultra-large base area which results in high overall thermal conductivity. It also offers a unique two-row fin pattern, which optimizes heat dissipation with minimal air flow obstruction.
Working Principle
The working principle of the ATS-12G-170-C1-R0 is based on the concept of thermal conductivity. When heat is generated by electrical components, it moves through the air and dissipates more easily in areas with higher thermal conductivity. ATS technology has used this principle to design a heat sink with an optimized base area and fin pattern, allowing for efficient dissipation without experiencing an airflow restriction.
The ATS-12G-170-C1-R0 is made from a combination of aluminum and copper. This combination helps to create a thermal bridge that efficiently conducts heat away from the hot area of the component and into the fin structure. The fins are then used to dissipate the heat to the surrounding environment. This is done by heat conduction, convection, and radiation. The two-row fin pattern helps to create powerful air flow dynamics that further enhance the heat dissipation process.
Conclusion
The ATS-12G-170-C1-R0 is a powerful and efficient heat sink designed to handle high heat loads. It is suitable for use in a variety of applications such as medical equipment, LED arrays, and servers. Its combination of aluminum and copper material helps to create a thermal bridge that efficiently conducts heat away from the components. Meanwhile, its two-row fin pattern helps to create powerful air flow dynamics that further enhance the heat dissipation process.
The specific data is subject to PDF, and the above content is for reference