Allicdata Part #: | ATS-12G-20-C1-R0-ND |
Manufacturer Part#: |
ATS-12G-20-C1-R0 |
Price: | $ 3.99 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 54X54X25MM XCUT |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ATS-12G-20-C1-R0 Datasheet/PDF |
Quantity: | 1000 |
10 +: | $ 3.62061 |
30 +: | $ 3.41922 |
50 +: | $ 3.21817 |
100 +: | $ 3.01701 |
250 +: | $ 2.81588 |
500 +: | $ 2.61474 |
1000 +: | $ 2.56446 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 2.126" (54.01mm) |
Width: | 2.126" (54.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.984" (25.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 7.13°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
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?Introduction
ATS-12G-20-C1-R0 is a type of thermal - heat sinks. Thermal heat sinks are devices that absorb and dissipate heat from other components to prevent them from overheating. ATS-12G-20-C1-R0 absorbs and dissipates heat from other components using a combination of thermal insulation and active air circulation. These heat sinks are designed to keep temperatures inside a device and its components within their safe range in order to ensure their optimal performance.
Application Field
The ATS-12G-20-C1-R0 thermal - heat sinks are often used in industrial machinery, power generation, electronics, medical equipment, and automotive components. These devices are also used in automotive cooling networks, cooling systems for computers, and industrial electronics.
Working Principle
The ATS-12G-20-C1-R0 thermal - heat sinks use two methods to dissipate heat from components. The first method is thermal insulation. The heat sink measures and absorbs the heat produced by the device’s components using the thermal insulation component. It is then dissipated by the active air circulation component. This process creates a low-pressure area inside the device, where cooler air is drawn in through vents on the device’s exterior. The air is then circulated through the device’s components, absorbing more heat and carrying it away from the device.
Conclusion
The ATS-12G-20-C1-R0 thermal - heat sinks are essential components for keeping temperatures within safe operating ranges in a wide range of devices. The device’s thermal insulation component absorbs heat, while its active air circulation component dissipates it away from the device. This ensures the optimal performance of the device and its components.
The specific data is subject to PDF, and the above content is for reference