ATS-12G-200-C3-R0

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The ATS-12G-200-C3-R0 is a thermal-heat sink, which is designed and operated for the purpose of dissipating heat from electronic components and other processes. The device is typically used for the cooling of CPUs, FPGAs, GPUs, and other high-performance integrated circuit components in various types of embedded application systems. In this article, we will examine the application fields and working principles of the ATS-12G-200-C3-R0 thermal-heat sink.

The ATS-12G-200-C3-R0 is a highly efficient and versatile thermal-heat sink design that can be used in a variety of applications and environments. It is mainly designed for the cooling of high-powered components in electronic systems, such as CPUs, FPGAs, GPUs, and other integrated circuit components. The device is capable of operating in hazardous and wet locations, and is also suitable for use in industrial and non-industrial systems, such as automotive, defence, aerospace, and medical industries. The device is also designed to work in a temperature range of -40F to +140F (-40C to +60C).

The ATS-12G-200-C3-R0 features a fin design with multiple fins for increased surface area, resulting in improved thermal diffusion. This device is designed to use a combination of convective and conductive heat transfer methods. The convective heat transfer is achieved by the vertical fins in the device, which act to increase the surface area and expose the heatsink surface to the surrounding air. As the air is drawn across the heatsink surface, the air absorbs the heat from the heatsink, transforming the thermal energy into kinetic energy, which is dissipated to the surrounding air.

The conductive heat transfer is achieved by the thermal interface materials that are placed between the metal fins and the components. The thermal materials act as a conducted path between the component and the thermal-heat sink. The thermal material also exerts a thermal energy transfer capability that helps dissipate the heat away from the component, while also increasing the heat transfer rate. This results in an overall improved thermal performance of the ATS-12G-200-C3-R0 thermal-heat sink.

In addition to dissipating heat, the ATS-12G-200-C3-R0 thermal-heat sink also offers protection against electrostatic discharge (ESD). The device is designed with ESD protection and a Faraday cage that prevents any stray, static electricity from interfering with the electrical circuits. This prevents damage to the component due to electrostatic discharge or other induced voltages.

The ATS-12G-200-C3-R0 thermal-heat sink is also designed with built-in thermocomes to protect the device from higher temperatures. The thermocouples are placed in strategic locations on the device to ensure that the device will shut off automatically if the temperature rises above a certain level. This prevents any damage to the component due to excessive heat.

The ATS-12G-200-C3-R0 also features a low-noise fan, which is designed to reduce the noise that is generated when the device is in operation. This noise reduction feature helps to maintain a quiet, comfortable working environment in the area where the thermal-heat sink is located. This low-noise fan also results in improved energy efficiency of the device, since it is not required to work as hard to achieve the desired temperature.

In conclusion, the ATS-12G-200-C3-R0 is a thermal-heat sink that is designed for high-performance application systems. It is designed with a finned design that increases the surface area, which results in improved thermal dissipation and better ESD and temperature protection. The device is also equipped with a low-noise fan, which helps to reduce the noise that is generated when the device is in operation, and the device is also designed to be energy-efficient.

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