| Allicdata Part #: | ATS-12G-36-C2-R0-ND |
| Manufacturer Part#: |
ATS-12G-36-C2-R0 |
| Price: | $ 5.82 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 36.83X57.6X11.43MM T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12G-36-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.23971 |
| 30 +: | $ 4.94865 |
| 50 +: | $ 4.65759 |
| 100 +: | $ 4.36647 |
| 250 +: | $ 4.07537 |
| 500 +: | $ 3.78427 |
| 1000 +: | $ 3.71150 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.450" (36.83mm) |
| Width: | 2.267" (57.60mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.82°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal – Heat Sinks are components used with electronic systems to assist with the cooling of heat producing devices. They’re primarily used to expand the surface area of a device and allow the necessary heat to dissipate. The ATS-12G-36-C2-R0 is a heat sink designed for heavy duty applications in extreme situations.
The ATS-12G-36-C2-R0 has an anodized fin body made from aluminum, which provides strength and is designed to dissipate heat quickly. Its fins are spaced a very close .062’’ making it ideal for applications with space constraints as well as for providing maximum cooling effectiveness. The device has a length of 3.6’’, a width of 3.6’’ and a thickness of 1.18’’ and can handle up to 12 Watts of power, making it significantly more powerful than other devices in its class.
The overall design of the ATS-12G-36-C2-R0 is designed with cooling efficiency in mind. The aluminum fin body is designed in such a way that it reduces air turbulence and optimizes airflow throughout the device. Additionally, the device has a number of additional features that help to reduce thermal impedance and allow heat to be dissipated more quickly. These features include a high thermal spreader base (a feature that helps to rapidly disperse heat away from the device’s core), high performance thermal pads and dissipator pads. All of these features are designed to help reduce any hot spots that can create temperatures higher than necessary.
In addition to its cooling capabilities, the ATS-12G-36-C2-R0 also offers a number of advantages over other devices. The device is lightweight, durable, and has a high power rating. It is also designed to be resistant to corrosion, as well as being able to handle higher temperatures. This makes the device ideal for applications in harsher environments, such as those found in military, aerospace and automotive industries.
In conclusion, the ATS-12G-36-C2-R0 is an excellent thermal solution for applications where heavy duty cooling efficiency is required. It is a highly efficient device which provides excellent thermal management, and is designed to dissipate heat quickly, enabling devices to operate at their peak performance. Its lightweight design and high power rating make the device well suited for use in a variety of applications, including those in extreme environments.
The specific data is subject to PDF, and the above content is for reference