| Allicdata Part #: | ATS-12G-40-C3-R0-ND |
| Manufacturer Part#: |
ATS-12G-40-C3-R0 |
| Price: | $ 6.40 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X60.96X11.43MM T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12G-40-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.76009 |
| 30 +: | $ 5.44026 |
| 50 +: | $ 5.12026 |
| 100 +: | $ 4.80022 |
| 250 +: | $ 4.48021 |
| 500 +: | $ 4.16019 |
| 1000 +: | $ 4.08019 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 2.400" (60.96mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.61°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-Heat Sinks
Thermal-Heat Sinks are used to absorb and dissipate heat generated by electronic components and devices. The most common type of thermal-heat sink is the Air-Flow Plate, which utilizes air to absorb and dissipate heat away from the device. The ATS-12G-40-C3-R0 is an advanced air-flow plate specifically designed to meet the needs of high performance applications. This article will discuss its application field and working principle.
Application Field
The ATS-12G-40-C3-R0 Air-Flow Plate is designed for high performance electronic device applications where maximum thermal transfer is required. The ATS-12G-40-C3-R0 is suitable for most electronic device assemblies such as CPUs, GPUs, and APUs. Other applications include power converters and motor controllers, data processors and servers, and many other high-power electronic components.
Features
The ATS-12G-40-C3-R0 features a novel aerodynamic-flow-plate design that optimizes heat dissipation and air flow while mitigating turbulence, noise, and air pockets. The design also allows for effective use of multiple air flows, providing more efficient heat transfer and improved cooling capability. The ATS-12G-40-C3-R0 also provides extra thermal mounting for improved thermal contact with devices. Additionally, it features built-in sensors that enable precise temperature monitoring, allowing for quick and accurate thermal management.
Working Principle
The ATS-12G-40-C3-R0 works by transferring heat from the device into the air via convection. The heat is absorbed by the plates and dissipated away from the device by a flow of air. The design of the plates is such that the air is guided across the plates in an aerodynamic pattern which increases the efficiency of heat transfer. The plates are also designed to minimize turbulence and create less noise. The built-in sensors enable precise temperature monitoring, allowing for quick and accurate thermal management.
Advantages
The ATS-12G-40-C3-R0 offers several advantages over traditional air-flow plates and other thermal solutions. The air-flow design increases the efficiency of heat transfer, reducing the temperature of the device. The improved cooling efficiency results in a longer life span of components and devices, as they are exposed to less heat. Additionally, the built-in sensors provide accurate real-time temperature monitoring for thermal management. Furthermore, the ATS-12G-40-C3-R0 is easy to install and requires minimal maintenance.
Conclusion
The ATS-12G-40-C3-R0 Air-Flow Plate is an advanced thermal solution specifically designed for high performance applications. Its aerodynamic-flow design helps to transfer and dissipate heat away from the device efficiently and quietly. Additionally, it features built-in sensors for precise temperature monitoring and improved thermal management. This makes the ATS-12G-40-C3-R0 a great choice for high performance applications that require maximum thermal transfer.
The specific data is subject to PDF, and the above content is for reference