| Allicdata Part #: | ATS-12G-57-C1-R0-ND |
| Manufacturer Part#: |
ATS-12G-57-C1-R0 |
| Price: | $ 3.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X20MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12G-57-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.13866 |
| 30 +: | $ 3.05361 |
| 50 +: | $ 2.88401 |
| 100 +: | $ 2.71435 |
| 250 +: | $ 2.54470 |
| 500 +: | $ 2.45987 |
| 1000 +: | $ 2.20541 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 13.13°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat sinks are key components used in a wide variety of electronic devices, primarily to dissipate the heat generated from the operation of electronics. They are used to keep components cool and in line with their optimal operating temperatures. As such, thermal heat sinks are an integral component of most modern electronics.
The ATS-12G-57-C1-R0 is a thermal heat sink designed to provide superior heat dissipation, with a low thermal resistance. This thermal heat sink combines the highest thermal efficiency with an ultra-low acoustic profile. It is a light weight thermal heat sink system that is perfectly suited for applications where sound levels must be minimized. Its open structure also allows for easy customization of the thermal heat sink’s thermal footprint.
The ATS-12G-57-C1-R0 acts as an “exchanger”, transferring thermal energy from the device’s hot surface to the ambient air. This thermal exchange is achieved by convective air flow and radiation. The thermal heat sink system is designed to minimize the thermal flux, effectively reducing the temperature of the device.
The ATS-12G-57-C1-R0 thermal heat sink is designed to be used in a variety of applications. It is suitable for high powered computing, LED lighting, communications systems, power supplies, medical imaging equipment, and automotive electronics. The thermal heat sink has a low profile and is built to stand up to the rigors of industrial conditions, making it suitable for systems installed in harsh environments.
The ATS-12G-57-C1-R0 works by creating a reactive thermal mass that absorbs heat generated from the components it is designed to cool. This thermal mass absorbs the heat, while simultaneously releasing cooler air back into the environment. The heat sink’s fins facilitate the natural convection that takes place between the hot surface and the cold air.
The ATS-12G-57-C1-R0 is also designed to be easily mountable. It features a compact footprint and simple installation requirements, along with all necessary mounting hardware. The thermal heat sink can also be customized for specific applications, such as those involving high airflow requirements.
In conclusion, the ATS-12G-57-C1-R0 Thermal Heat Sink is an efficient, low profile system that offers superior heat dissipation. Its lightweight, open structure makes it perfectly suited for applications where sound must be minimized, and its compact size makes it easy to install. The ATS-12G-57-C1-R0 is a reliable, cost-effective solution for a wide range of thermal heat sink applications.
The specific data is subject to PDF, and the above content is for reference