| Allicdata Part #: | ATS-12G-64-C1-R0-ND |
| Manufacturer Part#: |
ATS-12G-64-C1-R0 |
| Price: | $ 3.77 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X25MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12G-64-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.42405 |
| 30 +: | $ 3.23358 |
| 50 +: | $ 3.04340 |
| 100 +: | $ 2.85314 |
| 250 +: | $ 2.66293 |
| 500 +: | $ 2.47272 |
| 1000 +: | $ 2.42517 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.36°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is critical throughout the life of any electronic device in order to ensure the safe operation of the system and ensure the longevity of its components. The ATS-12G-64-C1-R0 is a thermal management device that is specifically designed to ensure adequate thermal management in electrical and electronic systems. This device is designed to provide efficient and reliable thermal management and cooling of electrical and electronic components. In this article, we discuss the application field and working principle of the ATS-12G-64-C1-R0.
Application Field
The ATS-12G-64-C1-R0 is an advanced thermal management device that is designed to provide dependable, consistent and efficient thermal management and cooling of electrical and electronic components. This thermal management device is designed to fit into tight spaces due to its small size and light weight. It is designed for applications such as personal computers, office equipment, industrial machinery and other applications where space is limited and thermal management is critical. In addition, it is designed to accommodate both modular and discrete components, providing superior thermal cooling with minimal space usage.
The ATS-12G-64-C1-R0 also has a range of temperature and speed setting options. It can be adjusted to provide cooling in a range of temperatures. It can also be programmed to provide different cooling speeds depending on the heat produced by the component. This ensures that components are kept at ideal temperatures and do not overheat.
Working Principle
The ATS-12G-64-C1-R0 is designed to use heat-sinking technology to facilitate efficient thermal management and cooling of electronic components. This involves the use of a thermally conductive material to allow heat to transfer quickly from the component to the sink. The thermal sink is designed to be placed directly on top of the component, allowing for maximum contact between the component and the sink. This contact allows the heat to transfer from the component to the sink quickly, preventing the component from overheating.
The thermal sink is equipped with several fins that are designed to increase its surface area, allowing more heat to be dissipated. The fins also help to increase the surface area of the thermal sink, making it more effective in dissipating heat. Additionally, the fins are designed to redirect heated air away from the component to further increase the cooling effect. The thermal sink also includes a fan to help further disperse hot air away from the component.
The ATS-12G-64-C1-R0 is an effective and reliable thermal management device that can help ensure the safe operation of electronic components and protect them from dangerous levels of heat. It is designed to provide efficient thermal management and cooling in tight spaces, while also allowing for adjustable temperature and speed settings. This thermal management device is easy to install and requires little maintenance, making it an ideal choice for applications where thermal management is critical.
The specific data is subject to PDF, and the above content is for reference