ATS-12G-75-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	0.984" (25.00mm)
Width:	0.984" (25.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	15.29°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks: ATS-12G-75-C3-R0 application field and working principle

Heat sinks are an essential element of any cooling system. The ATS-12G-75-C3-R0 model is a popular choice for many applications, as it offers reliable performance and reasonable cost. This article will discuss the application field and working principle of the ATS-12G-75-C3-R0 heat sink.

Application Field

The ATS-12G-75-C3-R0 heat sink is suitable for cooling of a wide variety of systems and components, including microprocessors, graphics cards, power supplies, and other types of electronics. The thermal design allows the heat sink to dissipate the heat efficiently and rapidly. As a result, it is widely used in high-end gaming systems, industrial applications, and computer systems that require reliable cooling.In addition, the ATS-12G-75-C3-R0 is an excellent choice for embedded system design, as the heat sink’s small footprint makes it easier to fit in confined spaces. Furthermore, this model is often used in applications with space constraints as it can be easily mounted onto flat surfaces. It can also be integrated into custom cooling solutions, making it a great choice for those who want to create their own.

Working Principle

The ATS-12G-75-C3-R0 is an Aluminum Heat Sink made of high-grade aluminum alloy. The material is designed to be lightweight and highly thermally conductive, allowing it to efficiently dissipate heat away from components.The ATS-12G-75-C3-R0 heat sink is designed to provide two-phase cooling. In the first phase, air is drawn into the heat sink’s cavity via fan blades. This air is cooled by aluminum fins, which draw heat away from the components. The cooled air is then released back into the system, resulting in a continuous air flow. In the second phase, a thin layer of high-density thermal grease is applied to the heatsink and components, creating a thermal conductive interface. This allows the heat from the components to be quickly and efficiently dissipated into the heat sink.

Conclusion

The ATS-12G-75-C3-R0 heat sink is a popular choice for cooling systems and components due to its reliable performance and reasonable cost. Its two-phase cooling allows for efficient heat dissipation and its lightweight design allows it to be easily installed in a variety of applications. With its efficient design, the ATS-12G-75-C3-R0 is an ideal choice for those who require reliable cooling solutions.

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