| Allicdata Part #: | ATS-12H-05-C3-R0-ND |
| Manufacturer Part#: |
ATS-12H-05-C3-R0 |
| Price: | $ 3.85 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12H-05-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.49524 |
| 30 +: | $ 3.40074 |
| 50 +: | $ 3.21174 |
| 100 +: | $ 3.02280 |
| 250 +: | $ 2.83387 |
| 500 +: | $ 2.73940 |
| 1000 +: | $ 2.45602 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.84°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a crucial element for the functioning of many electronic devices, as the technology advances the thermal management solutions become more complex and adapted to the particular needs of the product. One of these solutions is the ATS-12H-05-C3-R0 heat sink, a product specifically designed for applications that require high efficiency and reliable thermal performance.
This heat sink has a hollow body, with a two-part fin structure that creates a combination of resistance to air flow and excellent heat transfer capability. This construction helps the product to efficiently manage and dissipate heat, making it suitable for applications that require a compact design, and even in environments with restricted spaces. Furthermore, the ATS-12H-05-C3-R0 has multiple mounting points, allowing easy installation in a variety of systems.
The ATS-12H-05-C3-R0 may be used in a variety of applications, including LED lighting, automotive electronics, industrial electronics, and electronic component cooling. It is also suitable for high-end server and RAID applications, and in the case of sensitive devices, its thermal management system ensures the device is kept at a safe operational temperature.
The working principle of the ATS-12H-05-C3-R0 is based on the principles of dissipative convection. The two-part fin structure increases the surface area for heat exchange between the component and ambient environment, and this provides an efficient dissipation of thermal energy. This heat is then dissipated to the ambient air, reducing the temperature of the device and keeping it within the safe operational temperature range.
The hollow body design of the ATS-12H-05-C3-R0 and its two-part fin structure are both essential for its high efficiency. The structure allows air to penetrate deeper into the heat sink and to flow more evenly across the fins. This ensures maximum heat dissipation is achieved, while the hollow body design helps reduce the weight of the heat sink, making it suitable for small and lightweight applications. Additionally, the design also allows the ATS-12H-05-C3-R0 to be mounted in a range of orientations, as the design works in both vertical and horizontal applications.
In summary, the ATS-12H-05-C3-R0 is a reliable and efficient thermal management solution for a range of applications. Its lightweight design and two-part fin structure are essential for its thermal performance, which helps maintain the safe operational temperature range in sensitive devices. Furthermore, its multiple mounting points make it suitable for use in a variety of hardware configurations.
The specific data is subject to PDF, and the above content is for reference