ATS-12H-103-C1-R1 Allicdata Electronics
Allicdata Part #:

ATS-12H-103-C1-R1-ND

Manufacturer Part#:

ATS-12H-103-C1-R1

Price: $ 4.31
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X9.5MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-12H-103-C1-R1 datasheetATS-12H-103-C1-R1 Datasheet/PDF
Quantity: 1000
10 +: $ 3.87513
30 +: $ 3.65967
50 +: $ 3.44434
100 +: $ 3.22906
250 +: $ 3.01379
500 +: $ 2.79852
1000 +: $ 2.74471
Stock 1000Can Ship Immediately
$ 4.31
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.374" (9.50mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 27.64°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are a great way to keep components running at their optimum performance, and the ATS-12H-103-C1-R1 is no exception. Designed to take advantage of the unique properties of the metal aluminum, the ATS-12H-103-C1-R1 is the perfect heat sink for dissipating thermal energy from the components it protects.

One of the major advantages of the ATS-12H-103-C1-R1 is its ability to work with high temperatures. Due to its open style of design, it has the potential to dissipate heat while still allowing the use of high-powered components such as CPUs, GPUs, and other electronics. This makes it ideal for overclocking applications, as the extra heat can be quickly dissipated without compromising the integrity of the component.

Having an unrestricted space between the heat sink and the component makes the ATS-12H-103-C1-R1 a great choice for most applications. The open design allows air to freely flow in and out of the heatsink. This leads to better efficient cooling and helps to cut down on noise generated by turbulent airflow.

The ATS-12H-103-C1-R1 can also be used to protect components from electrostatic discharge (ESD). ESD is common among electronics, but with the ATS-12H-103-C1-R1’s open design, ESD can easily be managed with the help of anti-static materials such as conductive foam and shielded containers. This is important for protecting components and preventing unexpected system malfunctions.

In terms of performance, the ATS-12H-103-C1-R1 is hard to beat. Its aluminum construction helps to conduct heat away from components while still allowing for efficient air cooling. The ATS-12H-103-C1-R1 is designed with optimized pins to improve thermal transfer and airflow, ensuring optimum performance no matter the application. Moreover, it is durably made and includes a self-cleaning coating on its interior surfaces.

For those looking for a highly efficient and reliable way of cooling components, the ATS-12H-103-C1-R1 is a great choice. It is designed to handle high workloads and high temperatures, while still allowing for efficient air cooling. Its open style of design also helps to protect components from ESD, and its optimized pins ensure optimal performance. No matter the application, the ATS-12H-103-C1-R1 is capable of keeping components running at their peak performance.

The specific data is subject to PDF, and the above content is for reference

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