| Allicdata Part #: | ATS-12H-120-C1-R0-ND |
| Manufacturer Part#: |
ATS-12H-120-C1-R0 |
| Price: | $ 3.37 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12H-120-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.06684 |
| 30 +: | $ 2.98431 |
| 50 +: | $ 2.81849 |
| 100 +: | $ 2.65268 |
| 250 +: | $ 2.48686 |
| 500 +: | $ 2.40397 |
| 1000 +: | $ 2.15528 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.45°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-12H-120-C1-R0 is a thermal heat sink designed to remove heat from electronic components, like semiconductors, after their operation. This can protect the components from damage due to overheating and improve their performance. The ATS-12H-120-C1-R0 is constructed of a material that is highly efficient at dissipating heat. This material is attached to a heat sink base which is typically made out of aluminum and is then attached to the surface of the component to be cooled. This allows heat to be easily conducted away from the component and transferred to the heat sink.
One of the main advantages of the ATS-12H-120-C1-R0, is its ability to operate at a wide range of temperatures with a higher level of efficiency. This allows for greater flexibility when using this thermal heat sink in different environments. Additionally, the ATS-12H-120-C1-R0 is designed to act as a thermal barrier, reducing the amount of heat that is transferred to the surrounding environment. This is especially useful in areas with high ambient temperatures.
The ATS-12H-120-C1-R0 is typically used in applications such as computers, electronic equipment, and in situations where stability and good temperature control are especially important. These include areas such as laboratories, computer rooms, medical equipment, telecommunications systems, and more. The effectiveness of the ATS-12H-120-C1-R0 is dependent on a few variables, such as the size of the heat sink and the rate of heat dissipation.
The working principle of the ATS-12H-120-C1-R0 is based on the principle of thermal conduction. Heat energy generated by the component is conducted through the material of the heat sink and dissipated quickly into the surrounding environment. This process of thermal conduction relies on an efficient contact between the heat source (the component) and the heat sink. The larger the contact area, the better the heat transfer is.
The ATS-12H-120-C1-R0 is a leading thermal heat sink that is trusted by customers for being highly efficient, reliable, and cost-effective. Its thermal conductivity and temperature stability offer optimal protection for various electronic components. Its reliable performance makes it an ideal choice for many applications, allowing users to keep their equipment running safely and efficiently even in extreme environments.
The specific data is subject to PDF, and the above content is for reference