| Allicdata Part #: | ATS-12H-15-C3-R0-ND |
| Manufacturer Part#: |
ATS-12H-15-C3-R0 |
| Price: | $ 4.33 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12H-15-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.89781 |
| 30 +: | $ 3.68151 |
| 50 +: | $ 3.46487 |
| 100 +: | $ 3.24834 |
| 250 +: | $ 3.03178 |
| 500 +: | $ 2.81523 |
| 1000 +: | $ 2.76109 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.52°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks provide cooling to electronic components to prevent them from overheating which can cause permanent damage. The ATS-12H-15-C3-R0 is a heat sink designed to cool components in a variety of applications. This article will explore the application field and working principle of the ATS-12H-15-C3-R0.
The ATS-12H-15-C3-R0 is a lightweight, cost-effective, aluminium heat sink that provides efficient cooling for electronic components. It is designed for use in industrial and other applications where heat dissipation is needed. The heat sink is designed to fit onto components of similar size, so it can be easily and quickly installed. It is also designed for high performance, as it has a high heat transfer rate, low resistance and long-term thermal stability. Additionally, the heat sink is available in several sizes and can be tailored to fit the specific application.
The main application field of the ATS-12H-15-C3-R0 is the thermal management of circuits, components and electronic systems in industrial and other areas. The heat sink helps to dissipate the heat generated by components in electronic systems, thus reducing their temperature and maintaining proper operation. Additionally, the heat sink is often used for cooling of electrical components, including motor drives and other components that generate significant amounts of heat.
The working principle of the ATS-12H-15-C3-R0 heat sink is simple. Heat from the component is absorbed by the heat sink and is then dissipated away from the component, either by convection or radiation. The main benefit of using a heat sink is its ability to reduce component temperature. When the heat is dissipated, the system operates more efficiently, as the components are not operating at excessively high temperatures.
In order to ensure maximum performance, the heat sink must be properly sized and installed. The heat sink should be chosen to fit the application, taking into account the specific dimensions and weight of the component. Additionally, the heat should be applied in the appropriate manner, taking into account the air flow required for the cooling process. Proper installation is also important to provide maximum cooling performance.
The ATS-12H-15-C3-R0 heat sink is a reliable and cost-effective solution for thermal management of electronics. It is designed to ensure efficient heat transfer and dissipation and can easily be tailored to fit the specific application. With proper installation, it provides a long-term and reliable cooling solution that can help reduce component temperature and improve system performance.
The specific data is subject to PDF, and the above content is for reference