| Allicdata Part #: | ATS-12H-154-C3-R0-ND |
| Manufacturer Part#: |
ATS-12H-154-C3-R0 |
| Price: | $ 4.00 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X15MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12H-154-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.64329 |
| 30 +: | $ 3.44106 |
| 50 +: | $ 3.23870 |
| 100 +: | $ 3.03629 |
| 250 +: | $ 2.83387 |
| 500 +: | $ 2.63145 |
| 1000 +: | $ 2.58084 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.61°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is critical to the successful design and operation of industrial and commercial applications. Heat sinks are a key component in keeping equipment operating within desirable temperatures, and the ATS-12H-154-C3-R0 is a highly effective solution. This article explains the application field and working principle of ATS-12H-154-C3-R0.
AT-12H-154-C3-R0 is a heat sink designed for use in applications where relatively large surface area and good thermal conductivity are required. It is a large low profile assembly made with aluminum fin stock and a cast aluminum base. This makes it an ideal solution for applications with limited space and requiring good thermal efficiency. Typical applications include cooling power semiconductors such as passives, signal transistors, switching transistors and operational amplifiers. It is also used to cool high intensity lamps and bulbs such as LED, OLED, HID and halogen.
The working principle of AT-12H-154-C3-R0 is based on the principle of natural or forced convection. In natural convection, the surface of the heat sink is heated to a higher temperature than the surrounding air. As a result, hot air rises and is replaced by cool air from below. Natural convection is the most efficient method to remove heat from a device while ensuring a low-noise operation. In forced convection, a fan is used to blow cool air onto the heat sink and rapidly remove heat from the device.
In addition to natural and forced convection, AT-12H-154-C3-R0 uses a combination of convection and conduction. The heat sink has a large base that conducts the heat from the device. This heat is then dissipated through the fins, which increase the surface area for more efficient heat dissipation. The fins also act as a convection area, allowing air to flow through and over the fins, carrying the heat away from the device. This combination of convection and conduction provides good thermal performance and ensures the device operates at a safe temperature.
AT-12H-154-C3-R0 is a highly efficient heat sink designed to provide robust cooling performance in a range of environments. It is designed for use in applications where space is limited and good thermal efficiency is required. Its design offers good thermal conductivity and a large surface area for heat dissipation. Its combination of convection and conduction provides good thermal performance and ensures that the device operates within acceptable temperature ranges.
The specific data is subject to PDF, and the above content is for reference