| Allicdata Part #: | ATS21538-ND |
| Manufacturer Part#: |
ATS-12H-170-C2-R0 |
| Price: | $ 3.84 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12H-170-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.49020 |
| 10 +: | $ 3.40011 |
| 25 +: | $ 3.30800 |
| 50 +: | $ 3.12430 |
| 100 +: | $ 2.94052 |
| 250 +: | $ 2.75675 |
| 500 +: | $ 2.66487 |
| 1000 +: | $ 2.38918 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.07°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-12H-170-C2-R0 is an important thermal management device, commonly known as a heat sink. It is an aluminum extrusion designed to dissipate heat or energy generated by an electrical component and plays a critical role in the proper and safe functioning of many electrical and electronic systems throughout the world.
The primary purpose of the ATS-12H-170-C2-R0 is to transfer heat away from a device, such as a processor, graphics card, or other component, and then quickly dissipate heat into the surrounding environment. This reduces the temperature of the component or device, ensuring its reliable and safe functioning. Heat sinks are essential components connecting electrical and electronic systems, and guarantee the proper functioning and continual operation for a variety of applications.
The ATS-12H-170-C2-R0 is a large, convection-style heat sink, meaning that it uses natural air cooling as opposed to active air cooling, such as a fan. The heat sink\'s passive cooling design is composed of an aluminium extrusion that contains a large number of fins. The fins are designed to increase the surface area of the heat sink, thereby exposing as much of the heat sink fin surface to the air as possible. This increases the rate at which heat can be transferred away from the component or device. The fins also increase the speed at which the air around the heat sink can move, allowing for faster dissipation of heat.
In addition to its size and metal fin design, the ATS-12H-170-C2-R0 has been designed with a variety of mounting holes and features to ensure that it can be installed securely and firmly to any device. The heat sink also includes a thermal management system to help it perform at optimal levels, and this can be adjusted according to the size and characteristics of the device it\'s meant to cool.
The ATS-12H-170-C2-R0 offers far superior performance when compared to other conventional heat sinks, owing to its wide range of features and capabilities. Its large metal fins promote greater heat dissipation, while its mounting holes and adjustable thermal management system provide flexibility and convenient installation. The ATS-12H-170-C2-R0 is a highly efficient and reliable heat sink and is suitable for a variety of applications, including consumer electronics, thermoelectric cooling, and industrial automation.
The specific data is subject to PDF, and the above content is for reference