| Allicdata Part #: | ATS-12H-173-C1-R0-ND |
| Manufacturer Part#: |
ATS-12H-173-C1-R0 |
| Price: | $ 3.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X30MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12H-173-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.26907 |
| 30 +: | $ 3.18087 |
| 50 +: | $ 3.00422 |
| 100 +: | $ 2.82744 |
| 250 +: | $ 2.65074 |
| 500 +: | $ 2.56237 |
| 1000 +: | $ 2.29730 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.68°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management for electronic components is a critical part of ensuring reliable operation and performance. Heat sinks are used to dissipate heat generated by the electronic devices and components so they can remain within a safe temperature operating range. One such device is the ATS-12H-173-C1-R0, which is a high-performance heat sink designed for applications requiring precise thermal control.
The ATS-12H-173-C1-R0 is a 10-layer, 6.75 x 12.5 inch heat sink with a fin thickness of 0.012 in and an aspect ratio of 6.30. It has two mounting straps, two studs, four LED clips, and a single row of fins designed specifically for optimal directed airflow. As such, it is ideal for use in applications that require precise thermal control such as electronic systems involving LEDs, CPUs, or GPUs.
The ATS-12H-173-C1-R0 heat sink is made from alloy N9000 aluminum, making it extremely durable and long lasting. It is also protected against corrosion and is designed for use in corrosive environment applications. The heat sink allows for faster spread of heat away from the component and is designed with a fin profile that optimizes air convection for improved thermal performance.
The ATS-12H-173-C1-R0 is an active cooling device, meaning it uses a fan or other device to actively draw air over the fins and remove heat. The thermal design of the heat sink allows for the airflow generated by the fan to be more efficient as it spreads through the fins. This allows for a greater amount of cooling for a given fan speed. The active cooling also prevents the heat buildup that can otherwise occur with passive heat sinks.
The working principle of the ATS-12H-173-C1-R0 is relatively simple. The heat from the component dissipates through the fins and is then carried away by the air passing over them. The air is forced over the fins by a fan or blower and is then exhausted, carrying the heat away from the component and allowing it to cool. The fin profile and design of the heat sink maximizes air convection and encourages efficient cooling.
The ATS-12H-173-C1-R0 is an ideal heat sink solution for electronic systems requiring precise thermal control. Its high-performance design and active cooling provides efficient heat dissipation, resulting in reliable and consistent thermal performance. Its 10-layer, 6.75 x 12.5 inch design makes it suitable for a wide range of applications and its corrosion-resistant construction ensures its longevity and reliability.
The specific data is subject to PDF, and the above content is for reference