ATS-12H-186-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-12H-186-C1-R0-ND

Manufacturer Part#:

ATS-12H-186-C1-R0

Price: $ 3.85
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X35MM R-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-12H-186-C1-R0 datasheetATS-12H-186-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.49335
30 +: $ 3.29910
50 +: $ 3.10502
100 +: $ 2.91098
250 +: $ 2.71691
500 +: $ 2.52285
1000 +: $ 2.47433
Stock 1000Can Ship Immediately
$ 3.85
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.378" (35.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 2.77°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management has always been a critical factor in the performace of many electronics components. Heat sinks are essential tools that allow a device to efficiently transfer heat away and keep its temperature within normal operating levels. The ATS-12H-186-C1-R0 is a highly efficient heat sink designed for high power applications. Its design features make it an excellent choice for applications where precise thermal control is required.

The ATS-12H-186-C1-R0 is a thermal heat sink composed of several components. The primary component is a copper base which is machined to very precise tolerances. It is designed to communicate heat away from the device in which it is installed, and its large surface area maximizes contact with the device to facilitate maximum heat transfer. The copper base is also coated with a protective layer and heat pipe conductors that provide additional durability and heat dissipation.

The heat sink also features aluminum fins which are machined to optimize the surface area available for heat transfer. The aluminum fins are strategically placed and added in layers to provide maximum heat dissipation. Additionally, the design features air intake vents and channels that allow cool air to pass over and through the fins while removing hot air from the system.

The ATS-12H-186-C1-R0 also includes a fan attachment which works in conjunction with the other components to provide cooling support. The fan attachment includes an adjustable speed control and speed sensing circuitry that is used to monitor and adjust the fan’s operation according to the thermal demands of the device.

The primary function of the ATS-12H-186-C1-R0 is to transfer the heat generated by the device into the area around it. This heat is absorbed by the copper base and then conducted by the heat pipe conduits and aluminum fins into the surrounding air. In this way, the device\'s temperature is maintained at optimal levels.

The ATS-12H-186-C1-R0 is designed for high power applications that require precise thermal management. Its efficient heat transfer properties make it an ideal choice for applications such as power electronics, servers, telecommunications equipment, and other high-power electronic components that generate high levels of heat.

The ATS-12H-186-C1-R0 heat sink is also easy to install and comes with all the hardware and tools necessary for its assembly. Additionally, its design facilitates maintenance and can be adjusted and configured to meet the specific needs of any application.

In conclusion, the ATS-12H-186-C1-R0 is an excellent heat sink that works efficiently to dissipate heat from high power applications. Its design combines copper and aluminum to ensure maximum heat transfer, and includes an adjustable fan attachment for additional cooling support. The ATS-12H-186-C1-R0 is easy to install and is an excellent choice for any application that requires precise thermal management.

The specific data is subject to PDF, and the above content is for reference

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