ATS-12H-189-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	4.82°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

The ATS-12H-189-C3-R0 thermal heat sink is a widely used cooling device. It is designed to dissipate heat from various electrical components quickly and efficiently, while providing long-term stability. The device is effective in both industrial and commercial settings, and is suitable for use in areas where air cooling is not effective.

Application Field

The ATS-12H-189-C3-R0 thermal heat sink is used primarily to cool components in the areas of electronics, medical, automotive, military, aerospace, and industrial applications. It can keep various components, such as integrated circuits, transistors, memory, processors, etc., operating at their optimal temperatures for long periods of time; while also protecting them from damage from thermal fatigue.In industrial settings, the device is usually used as an auxiliary cooling system for large generating plants, which contain high levels of heat-generating components. It can also be used to reduce the effects of high operating temperatures in a wide range of machinery and equipment. Automotive applications include the need for cooling of the engine, electric components, and batteries.

Working Principle

The ATS-12H-189-C3-R0 thermal heat sink is designed to dissipate heat quickly and efficiently, while maintaining low temperatures in the area of the components. Generally, the device consists of a substrate or heat-sink material which is attached to a metal base with thermal-conductive epoxy glue.The substrate is then fitted with aluminum fins, which are designed to improve the flow of air on the components. The fins also increase the surface area of the heat sink, allowing for more efficient heat dissipation. The fins are then connected to a fan or a blower for the passage of air over the component.The device is designed to ensure adequate air circulation and to prevent hot spots from forming in the component. The fan or blower then forces air through the fins, allowing for maximum heat dissipation. The fan or blower can be either mechanical or electronic.

Conclusion

The ATS-12H-189-C3-R0 thermal heat sink is a highly efficient cooling device which is suitable for use in many different applications. Its efficient design and reliable performance make it a popular choice for cooling components in industrial, medical, automotive, military, aerospace, and other settings. The device is an excellent choice for those looking to reduce the effects of high temperatures on delicate components.

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