ATS-12H-195-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-12H-195-C1-R0-ND

Manufacturer Part#:

ATS-12H-195-C1-R0

Price: $ 3.13
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X12MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-12H-195-C1-R0 datasheetATS-12H-195-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.81736
30 +: $ 2.74134
50 +: $ 2.58905
100 +: $ 2.43671
250 +: $ 2.28446
500 +: $ 2.20830
1000 +: $ 1.97985
Stock 1000Can Ship Immediately
$ 3.13
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.472" (12.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 10.88°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal – Heat Sinks are an important component in the design of heat transfer systems. They are designed to dissipate the heat generated by electronic equipment, helping to protect the systems from overheating and shutdowns. The ATS-12H-195-C1-R0 is a premium heat sink that is designed to provide reliable, effective, and safe cooling for most applications.

Application of ATS-12H-195-C1-R0

The ATS-12H-195-C1-R0 is a high-performance thermoelectric heat sink that can be used in a variety of applications. It is designed to be used in applications where a larger cooling device is not available or needed. Its low profile design is perfect for cooling high power LED applications, as well as many other devices that require efficient cooling solutions. It can also be used to cool CPUs, GPUs, and other processors that generate a large amount of heat. Additionally, its small size and lightweight design make it an ideal choice for portable devices that may be used in harsh environments.

Features of ATS-12H-195-C1-R0

The ATS-12H-195-C1-R0 features a strong aluminum alloy base and a highly efficient heat dissipation structure. This construction ensures high thermal performance and durability. It also features an easily mountable, slim heat sink design, enabling it to fit in even the tightest of spaces. It is also designed to be highly corrosion-resistant and difficult to oxidize. Additionally, its thermally conductive material ensures that the heat is quickly dissipated from the surface of the heat sink into the atmosphere, rather than trapped inside the device.

Working Principle of ATS-12H-195-C1-R0

The ATS-12H-195-C1-R0 features a highly efficient heat dissipation structure. The heat generated by the device is transferred from the source material to the thermal interface material, and then through to the heat sink. This ensures that the heat is quickly and efficiently dissipated from the surface of the device. Furthermore, the heat sink features a highly efficient air flow design that helps to further reduce the amount of heat that is retained in the device.

Overall, the ATS-12H-195-C1-R0 is an efficient, reliable, and durable thermal management solution that can be used in a wide variety of applications. Its slim, lightweight design makes it perfect for devices that need efficient cooler solutions, such as high power LED applications. Furthermore, its corrosion-resistant material ensures that it will remain effective for a long time. Its efficient heat dissipation structure also ensures that the heat generated by the device is quickly dissipated.

The specific data is subject to PDF, and the above content is for reference

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