ATS-12H-20-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-12H-20-C1-R0-ND

Manufacturer Part#:

ATS-12H-20-C1-R0

Price: $ 3.99
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X54X25MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-12H-20-C1-R0 datasheetATS-12H-20-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.62061
30 +: $ 3.41922
50 +: $ 3.21817
100 +: $ 3.01701
250 +: $ 2.81588
500 +: $ 2.61474
1000 +: $ 2.56446
Stock 1000Can Ship Immediately
$ 3.99
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.126" (54.01mm)
Width: 2.126" (54.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.13°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Thermal - Heat sinks are devices used to assist in the removal of excess heat from electronic components and to keep them within a working temperature range. The ATS-12H-20-C1-R0 is a heat sink designed to help manage the thermal energy created by electronic components.

Application Field

The ATS-12H-20-C1-R0 is a type of high performance heat sink designed for extending the performance of electronic components beyond their normal limits. This heat sink is typically used in desktop Ethernet switch applications and products that require a higher level of thermal management than other solutions can provide. It is constructed with an integrated active cooling fan and thermal-resistant aluminum fins that dissipate heat quickly and effectively, making it ideal for applications such as providing enhanced data speed and reliability.

Working Principle

The ATS-12H-20-C1-R0 works by rapidly transferring thermal energy away from heated electronic components, resulting in a cooler operation environment. This heat sink is designed to be used with motherboards that employ the use of both passive and active cooling systems. The active cooling fan circulates air through the heatsink, cooling the individual components in the vicinity. This air movement draws heat away from the heated components, resulting in a significantly cooler environment. The Thermal-resistant aluminum fins on the heatsink also greatly increase the heat dissipated. The ATS-12H-20-C1-R0 is a quiet, low-maintenance and efficient device that provides an optimal cooling solution for electronic devices. This heat sink has been designed to work in a wide variety of applications, with an operating temperature range of -20 to 80 °C. It is simple to install and requires minimal care and maintenance, making it an ideal choice for a wide range of projects.

Conclusion

The ATS-12H-20-C1-R0 is a specialized heat sink designed for use in applications in which reliable thermal management of electronic components is paramount. It is constructed with an active cooling fan and Thermal-resistant aluminum fins for effective heat dissipation, and is suitable for use in a wide range of applications with an operating temperature range of -20 to 80 °C. This reliable and easy-to-install device is a great choice for any project in need of efficient cooling.

The specific data is subject to PDF, and the above content is for reference

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