ATS-12H-205-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.362" (60.00mm)
Width:	2.362" (60.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.236" (6.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	12.98°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks: ATS-12H-205-C1-R0 application field and working principle

Heat sinks are a common component in electronics, used to protect sensitive components from overheating. In general, they work by dissipating heat away from the component, allowing it to remain cooler and operate more efficiently. The ATS-12H-205-C1-R0 is a thermoelectric heat sink designed for high-reliability applications. This article will discuss the application field of the ATS-12H-205-C1-R0 heat sink, as well as its working principle.The ATS-12H-205-C1-R0 is designed for high-reliability applications such as military, aerospace, medical, and industrial. Its solid fin construction ensures that it can handle the toughest conditions, while its low profile design makes it compact and lightweight. The unit has an anodized aluminum base plate, which provides enhanced heat dissipation for the most demanding applications. The anodized aluminum base plate also ensures that the fins stay cool for optimal performance.The working principle of this heat sink is based on the thermoelectric effect. The thermoelectric effect is the conversion of temperature differences into electric voltages, and vice versa. The ATS-12H-205-C1-R0 utilizes this effect to regulate temperature, as well as to dissipate heat away from components.The device is composed of two plates connected by two P-type and two N-type thermoelectric couples called elements. When a voltage is applied across the elements, a current will flow. This current generates a heat gradient, causing heat to transfer from the higher temperature plate to the lower temperature plate. The device is designed to efficiently conduct heat away from components, allowing them to operate without overheating.In conclusion, the ATS-12H-205-C1-R0 thermal heat sink is designed for high-reliability applications such as military, aerospace, medical, and industrial. It utilizes the thermoelectric effect to regulate temperature and dissipate heat away from components, preventing them from ever overheating. This efficient heat management ensures optimal performance in any situation.

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