| Allicdata Part #: | ATS-12H-209-C3-R0-ND |
| Manufacturer Part#: |
ATS-12H-209-C3-R0 |
| Price: | $ 6.38 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12H-209-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.73741 |
| 30 +: | $ 5.41842 |
| 50 +: | $ 5.09972 |
| 100 +: | $ 4.78094 |
| 250 +: | $ 4.46221 |
| 500 +: | $ 4.14348 |
| 1000 +: | $ 4.06380 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.33°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are essential components when it comes to effectively managing the heat dissipation of electrical and electronic devices. The ATS-12H-209-C3-R0 Heat Sink is one of the most efficient in its product category as it fits the physical, technical and economic requirements of today\'s applications. The below paragraph explains the application of ATS-12H-209-C3-R0 Heat Sink and working principle.
The ATS-12H-209-C3-R0 heat sink is used as part of the system in order to dissipate heat from electrical and electronic components. It is designed for both air and surface cooling applications. The ATS-12H-209-C3-R0 is used in areas where small size and lasting performance are requirements. It is used in many products such as server enclosures, servers, displays, and 3D printers. It is also used in medical and automotive applications.
The ATS-12H-209-C3-R0 thermal-heat sink is designed to effectively dissipate heat from an electrical and/or electronic component. The design is based on the principles of heat conduction and adhesion. The heat sink is composed of materials that have good thermal conductivity and high adhesion properties, allowing the heat to be effectively transferred from the component to the surface of the heat sink.
The ATS-12H-209-C3-R0 thermal-heat sink has a series of vertical fins that increase heat transfer rates. The fins vary in shape and size to accommodate different components. The fins have a high surface area, which increases the rate of heat dissipation. The fins also act as a barrier to prevent air convection currents from carrying away the heat, thus ensuring effective heat transfer to the component.
The ATS-12H-209-C3-R0 thermal-heat sink is designed to provide maximum efficiency and cooling performance. The heat sink uses a combination of adhesion and conduction to effectively transfer heat away from an electronic component. The ATS-12H-209-C3-R0 is designed to operate in extreme thermal environments, with a maximum operating temperature of 85 degrees celsius. It is also capable of withstanding heavy loads due to its light weight and high strength design.
The ATS-12H-209-C3-R0 thermal-heat sink is a cost-effective and reliable solution for dissipating heat from electrical and electronic components. It is designed to operate in extreme thermal environments and has a high surface area to maximize heat transfer rates. The ATS-12H-209-C3-R0 is light weight and durable, making it an ideal choice for many applications.
The specific data is subject to PDF, and the above content is for reference