| Allicdata Part #: | ATS-12H-26-C3-R0-ND |
| Manufacturer Part#: |
ATS-12H-26-C3-R0 |
| Price: | $ 6.90 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12H-26-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 6.21117 |
| 30 +: | $ 5.86635 |
| 50 +: | $ 5.52119 |
| 100 +: | $ 5.17614 |
| 250 +: | $ 4.83106 |
| 500 +: | $ 4.48599 |
| 1000 +: | $ 4.39972 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.24°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are specific cooling devices used to help lower temperatures of certain electronic components or components with high operating temperatures. Heat sinks come in many shapes and sizes, such as the ATS-12H-26-C3-R0.
ATS-12H-26-C3-R0 application field and working principle:
The ATS-12H-26-C3-R0 is a high-performance heat sink designed to cool high-power electronics. This heat sink is constructed with an aluminum or copper base and aluminum fins to maximize the thermal transfer properties of the device. This makes it ideally suited for cooling digital signal processors, microprocessors, power transistors, electronic voltage regulators, and more.
The ATS-12H-26-C3-R0 relies on a combination of conduction and convection to dissipate heat from the device to the atmosphere. The aluminum or copper base is used to conduct heat away from the component being cooled, while the aluminum fins provide a larger surface area to maximize the transfer of the heat from the sink to the environment.
The ATS-12H-26-C3-R0 also features high-pressure air management components. These components activate when air passes over the heat sink, creating a turbine-like vortex. This maximizes airflow over the heat sink, allowing for more efficient heat dissipation.
The ATS-12H-26-C3-R0 is an ideal solution for those looking for maximum cooling efficiency. The combination of conduction, convection, and high-pressure air management make it a top choice for cooling large, high-power electronics. In addition, its aluminum or copper base and fins improve the thermal transfer properties, allowing for faster and more efficient cooling.
Conclusion:
The ATS-12H-26-C3-R0 is a highly efficient heat sink solution designed to cool large, high-power electronics. Its aluminum or copper base and fins increase thermal transfer properties, while its high-pressure air management components create a turbine-like vortex to maximize airflow. The combination of these features makes the ATS-12H-26-C3-R0 a top choice for those looking for maximum cooling efficiency.
The specific data is subject to PDF, and the above content is for reference