| Allicdata Part #: | ATS-12H-46-C3-R0-ND |
| Manufacturer Part#: |
ATS-12H-46-C3-R0 |
| Price: | $ 3.51 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X25MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12H-46-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.18591 |
| 30 +: | $ 3.09981 |
| 50 +: | $ 2.92774 |
| 100 +: | $ 2.75549 |
| 250 +: | $ 2.58325 |
| 500 +: | $ 2.49714 |
| 1000 +: | $ 2.23882 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.84°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is essential in any application where heat is generated, as it influences temperature, performance, and durability of the system as a whole. The ATS-12H-46-C3-R0 is a thermal solution designed to cool high-power electronic components such as power transistors. By dissipating thermal energy generated by the component to the surrounding environment, it can sustain peak performance and minimize component degradation.
The ATS-12H-46-C3-R0 is a heat sink designed to fit in a 12-mm hole. It has a three-hole solution, with a maximum load capacity of 46 W. It\'s also surface-mountable, so installation is very easy and doesn\'t require additonal wiring. The overall dimensions are 58mm x 13mm x 11mm.
The primary thermal management unit in the ATS-12H-46-C3-R0 is a finned aluminum extruded heat sink. The fins increase the surface area of the heat sink, allowing it to more efficiently dissipate heat over its entire surface. The air flowing around the fins further enhances the cooling process. This provides the following primary advantages for applications:
- Faster and more efficient heat dissipation
- Higher component loading capability
- Stabilization of the internal temperature
- Extension of component life
To further enhance the performance of the ATS-12H-46-C3-R0, various types of heat transfer devices may be used. These can range from fans, impellers, centrifugal blowers, and air circulation pumps. When using fans, for example, the speed can be regulated to adjust air velocity and consequently the rate of heat dissipation. Additional components such as heat pipes, thermal interface materials (TIMs), plate fins, and cold plates can also be used to further enhance the unit\'s performance.
Although the ATS-12H-46-C3-R0 is particularly intended for high power applications, it can be used for any instance where heat is generated, such as power supplies, amplifiers, notebooks, industrial equipment, and embedded systems. In each of these scenarios, the ATS-12H-46-C3-R0 offers efficient heat dissipation, improved system performance, and extended component lifespan.
The specific data is subject to PDF, and the above content is for reference