| Allicdata Part #: | ATS-12H-61-C1-R0-ND |
| Manufacturer Part#: |
ATS-12H-61-C1-R0 |
| Price: | $ 3.31 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X10MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12H-61-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.00762 |
| 30 +: | $ 2.92635 |
| 50 +: | $ 2.76381 |
| 100 +: | $ 2.60127 |
| 250 +: | $ 2.43868 |
| 500 +: | $ 2.35738 |
| 1000 +: | $ 2.11351 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 21.94°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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,Thermal - Heat Sinks
Heat sinks are common components used in various engineering applications, and are used to reduce the amount of heat generated by the component they protect. The ATS-12H-61-C1-R0 heat sink is a device intended for use with specific types of semiconductor or integrated circuit packaging. Here, we will discuss the application field and working principle of the ATS-12H-61-C1-R0 heat sink.
Application Field
The ATS-12H-61-C1-R0 heat sink is designed primarily for use with dual in-line packages (DIPs) and Power MOSFETs. It is made of aluminum and uses four pins to mount it to the device. The four pins are evenly spaced and positioned such that the device can be securely mounted to the component. Additionally, the heat sink has fins which are designed to increase the surface area to improve heat dissipation.
The ATS-12H-61-C1-R0 is designed to accommodate chips that have package sizes of 24, 24P, 30 and 40. It can be used in a variety of applications, including computer power supplies, automotive electronics, audio electronics, and power converters.
Working Principle
The ATS-12H-61-C1-R0 is designed to dissipate heat from the component by increasing the surface area. This is done by the heat sink\'s fin geometry, which increases the surface area exposed to the air flow around the device. This increased surface area helps increase the flow of heat away from the component into the air.
The heat sink also utilizes the four pins to attach it to the device, as these pins extend down and away from the component. This helps to further increase the surface area exposed to the air, as well as provide a secure attachment for the heat sink. Additionally, the aluminum construction helps to further dissipate heat away from the component.
Once the heat sink is attached to the component, air flows around the device, which helps to cool the component. The fins on the heat sink help to increase the surface area, which, in turn, increases the rate at which the component can be cooled. Additionally, the aluminum construction helps to further dissipate the heat away from the component.
Conclusion
The ATS-12H-61-C1-R0 heat sink is designed to help reduce the amount of heat generated by the semiconductor or integrated circuit package it is attached to. It utilizes a combination of fins and pins to increase the amount of surface area exposed to the air flow, and utilizes aluminum construction to further dissipate the heat away from the component.
The specific data is subject to PDF, and the above content is for reference