ATS-12H-72-C1-R0

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Thermal - Heat Sinks are widely used in today’s electronics industry because they are capable of rapidly dissipating heat away from hot spots. They are usually used to cool the processor, memory, and other components that generate a lot of heat. As such, the heat sink is an essential component of most electronic designs.

The ATS-12H-72-C1-R0 series of Thermal - Heat Sinks from Advanced Thermal Solutions is specifically designed for cooling applications in telecommunications, medical, military and industrial instrumentation. It is a rugged, high performance heat sink featuring an innovative design for efficient heat dissipation. The ATS12H-72-C1-R0 utilizes the latest in thermal engineering technology to maximize cooling capabilities and maintain long lasting operation. It is also designed to minimize noise emission, so it can be used in a variety of noise sensitive applications.

The ATS12H-72-C1-R0 features an aluminum extrusion body that is rugged yet lightweight. The base is machined to a perfectly flat surface to ensure good contact between the heat sink and the component it’s cooling. Additionally, the ATS12H-72-C1-R0 is provided with two sets of mounting holes for easy installation. It also features double anodized surface for maximum heat dissipation and corrosion resistance.

The ATS12H-72-C1-R0 provides robust performance in high vibration environments such as automotive, telecom and industrial control, and is capable of operating temperatures up to 150°C. The design also enables use of different types of finned surface materials such as aluminum, steel, copper and plastics, allowing designers to choose the best materials to suit their application. The ATS12H-72-C1-R0 is designed to perform in a broad range of applications, from large industrial cooling applications to smaller commercial and personal electronics.

In applications that require high performance cooling, the ATS12H-72-C1-R0’s unique design features a series of strategically placed cooling channels. These channels maximize the surface area available for heat removal by creating greater conduction between the component and the heat sink. This allows for better and more efficient heat dissipation and eliminates hot spots, resulting in greater performance and stability. Additionally, the ATS12H-72-C1-R0 features four prominent fins for increased heat dissipation and two large cooling holes to improve performance in high temperature environments.

The ATS12H-72-C1-R0’s innovative design also makes it a great choice for applications with limited space. Its extrusion body is compact in size yet provides superior cooling due to its unique fin configuration. Because of its advanced cooling features and compact size, the ATS12H-72-C1-R0 is an excellent choice for use in tight spaces, such as mobile applications. Additionally, the ATS12H-72-C1-R0 is designed to provide reliable and efficient cooling in a wide variety of operating conditions.

The ATS12H-72-C1-R0 is a powerful and reliable solution for many high-traffic and high-temperature applications. From industrial and automotive to consumer electronics, the ATS12H-72-C1-R0 provides superior cooling performance in rugged and tight spaces. With its advanced thermal design and construction, the ATS12H-72-C1-R0 is the ideal choice for advanced Thermal - Heat Sink applications.

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