ATS-12H-95-C1-R0

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Thermal management is essential for the safe and reliable operation of electronic components and systems. Heat sinks are used to facilitate the dissipation of wasted heat and are an integral part of most electronic systems. The ATS-12H-95-C1-R0 is one such heat sink, designed for use in applications such as power devices, RF amplifiers, and high-voltage power supplies. In this article, we will explore the application field and working principles of the ATS-12H-95-C1-R0 heat sink.

Application Field

The ATS-12H-95-C1-R0 is a type of heat sink designed for use in applications such as power devices, RF amplifiers, and high-voltage power supplies. It is designed to efficiently dissipate heat to the surrounding environment, preventing excessive temperatures and ensuring reliable performance. Its advanced design is suitable for high-current and high-power applications. It is also capable of withstanding harsh operating environments and can provide significant cooling benefits when used correctly.

Design Specifications

The ATS-12H-95-C1-R0 heat sink is constructed from a combination of materials, including aluminum and copper. It features a footprint measuring 95x95mm (3.74\'\' x 3.74\'\') and is 7.5mm (0.30\'\') thick. It is designed to have a thermal resistance of 4.64°C/W, allowing for efficient heat dissipation. It is also designed to be thermally conductive, with a thermal conductivity of 1.38x10-3W/m-K, which helps to maximize its cooling capabilities. Additionally, it is capable of handling up to 64A of current without creating excessive temperature rises.

Working Principle

The ATS-12H-95-C1-R0 heat sink operates on the simple principle of thermodynamic heat transfer. Heat is transferred from the heat source (in this case, a power device, RF amplifier, or high-voltage power supply) to the heat sink, which dissipates it to the surrounding environment. This process helps to keep the temperature of the heat source within safe operating parameters, improving its reliability and reducing the risk of damage or failure. The dissipation of heat is facilitated by the heat sink’s high-conductivity materials, which are designed to efficiently pull heat from the heat source and disperse it over a large area.

Conclusion

The ATS-12H-95-C1-R0 is a heat sink designed for applications such as power devices, RF amplifiers, and high-voltage power supplies. It is constructed from a combination of materials, including aluminum and copper, measures 95x95mm (3.74\'\' x 3.74\'\'), and is 7.5mm (0.30\'\') thick. It can handle up to 64A of current and features a thermal resistance of 4.64°C/W and a thermal conductivity of 1.38x10-3W/m-K. The ATS-12H-95-C1-R0 operates on a simple principle of thermodynamic heat transfer, allowing it to efficiently dissipate heat from the heat source to the surrounding environment, thereby improving system reliability and reducing the risk of damage or failure.

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