ATS-13A-01-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-13A-01-C1-R0-ND

Manufacturer Part#:

ATS-13A-01-C1-R0

Price: $ 3.16
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X10MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-13A-01-C1-R0 datasheetATS-13A-01-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.86524
30 +: $ 2.78754
50 +: $ 2.63277
100 +: $ 2.47785
250 +: $ 2.32301
500 +: $ 2.24557
1000 +: $ 2.01326
Stock 1000Can Ship Immediately
$ 3.16
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 21.90°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management solutions help to ensure maximum performance and reliability of equipment operating in extreme environments. Heat sinks are a type of thermal solution used to cool electronic components. The ATS-13A-01-C1-R0 heat sink is designed for optimal cooling and reliability in extreme operating conditions. In this article, we will discuss the application fields and working principle for the ATS-13A-01-C1-R0 heat sink.

Optimized Design

The ATS-13A-01-C1-R0 heat sink is designed to provide optimal cooling for extreme operating conditions. The optimized design combines a number of features to maximize efficiency. The heat sink features an extruded aluminum body and a laser-etched fin pattern to increase surface area for efficient heat dissipation. The body and fin pattern are designed to promote air flow through the device. The heat sink also includes four mounting screws to facilitate secure and reliable installation.

Application Field

The ATS-13A-01-C1-R0 heat sink is designed for use in a variety of extreme environments, such as industrial automation, aerospace, and defense applications. The heat sink can be used with a variety of electronic components, such as motors, switching power supplies, and other high-power, high-power-dissipation devices. The device is also capable of cooling components in aerospace and automotive applications, allowing for greater reliability and performance.

Working Principle

The working principle behind the ATS-13A-01-C1-R0 heat sink is quite simple. The heat sink’s extruded aluminum body and laser-etched fin pattern promote air flow and dissipate heat away from the components. The heat from the components is transferred to the heat sink, where it is dissipated into the surroundings. The four mounting screws provide a secure and reliable connection that helps to ensure the ATS-13A-01-C1-R0 heat sink is firmly attached to the components.

Conclusion

The ATS-13A-01-C1-R0 heat sink is designed to provide efficient cooling in extreme operating conditions. The optimized design and reliable mounting features ensure maximum performance and reliability. The device’s application field includes industrial automation, aerospace, and defense applications. The working principle behind the heat sink is quite simple, with heat from the components transferred to the device and dissipated into the surroundings. Overall, the ATS-13A-01-C1-R0 heat sink is an ideal solution to keep your components running at peak performance.

The specific data is subject to PDF, and the above content is for reference

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