| Allicdata Part #: | ATS-13A-05-C3-R0-ND |
| Manufacturer Part#: |
ATS-13A-05-C3-R0 |
| Price: | $ 3.85 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13A-05-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.49524 |
| 30 +: | $ 3.40074 |
| 50 +: | $ 3.21174 |
| 100 +: | $ 3.02280 |
| 250 +: | $ 2.83387 |
| 500 +: | $ 2.73940 |
| 1000 +: | $ 2.45602 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.84°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are devices designed to help reduce the amount of heat built up in an electronic system. ATS-13A-05-C3-R0 is a special kind of heat sink designed to be used in a variety of challenges related to high-density electronics packaging. This device has a unique combination of features that makes it ideal for thermal management in many applications.
The ATS-13A-05-C3-R0 is a finned heat sink, meaning that it has numerous fins attached to its exterior surface. These fins increase the surface area of the heat sink and allow it to dissipate heat more quickly and efficiently than a standard surface-mount device. Furthermore, the ATS-13A-05-C3-R0 has a unique design that allows for the fins to be arranged in multiple ways, increasing the flexibility of the device and making it more suitable for certain applications.
The working principle of the ATS-13A-05-C3-R0 is relatively simple. When the device is used in an electronic system, heat is generated due to the passage of electrical current through the device. This heat is then dissipated from the component, either through the external fins of the heat sink or through the use of an internal fan. This process of heat transfer helps to keep the temperature of the device within a safe range, which in turn helps to prevent potential harm to the device or connected components.
When it comes to applications, the ATS-13A-05-C3-R0 is particularly useful for high-power electronics that produce a great deal of heat. The increased surface area of the fins allows the heat sink to dissipate this heat much more quickly and efficiently than other types of heat sinks. Additionally, its unique fin arrangement provides flexibility in terms of the heat dissipation process, allowing the user to customize the heat sink\'s performance to the specific application at hand.
The ATS-13A-05-C3-R0 is also suitable for use in a variety of other applications. The device is extremely light and compact, meaning it can be used in a variety of confined spaces. Additionally, the device has an integrated mounting system, which allows for easy installation and removal from the application. Furthermore, the device provides excellent heat transfer performance with minimal interference, making it well-suited for a wide range of applications.
In conclusion, the ATS-13A-05-C3-R0 is a highly advanced and versatile finned heat sink. Its design provides excellent heat transfer, flexibility in terms of fin arrangement, and easy installation. In addition, the device\'s robust thermal performance and compact size make it suitable for a variety of challenges related to high-density electronics packaging. As a result, the ATS-13A-05-C3-R0 makes for an ideal heat sink in many applications.
The specific data is subject to PDF, and the above content is for reference